3D Stacked Memory Architect

Micron Technology; Boise (ID); On-site; USD 177,000 - 387,000; Full time

Benefits offered by this job

Medical/Dental/Vision plans

Paid time off

Equity

Job summary

Micron Technology in the United States seeks a Senior Memory Architect to define 3D stacked memory architectures that span die, stack, packaging and system. You will lead through technical depth, guide major architectural decisions and translate bold ideas into production reality.

The role requires a strong background in stacked memory, high-speed I/O and memory system design, with leadership experience across engineering teams and collaboration with customers and platform partners.

Qualifications

• Bachelor's degree required in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
• Extensive experience in stacked memory, 3D integration, advanced packaging, or high-performance semiconductor architecture.
• Deep hands-on expertise in high-speed I/O, TSV-based stacking, power delivery, thermals, and signal integrity.

Responsibilities

• Define next-generation 3D stacked memory architectures spanning bandwidth, capacity, power efficiency, and RAS.
• Lead die-to-system co-optimization across memory die, PHY, TSVs, bonding, packaging, and system integration.
• Architect stack-aware RAS, telemetry, and reliability mechanisms for high-density memory systems.
• Drive long-range technology strategy for stacked memory and advanced packaging.
• Engage deeply with customers, platform partners, and standards bodies to influence system and ecosystem direction.

Skills

3D stacked memory

Memory architecture

High-speed I/O

System-level co-optimization

Technical leadership

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, or Computer Science

Job description

Req ID: JR96646 3D Stacked Memory Architect Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We build the memory technologies that power the world’s most demanding platforms. Our team works at the intersection of silicon, packaging, and systems, pushing the limits of bandwidth, efficiency, and reliability. If you want to shape where memory goes next, this is the place to do it. This role sits at the center of our next-generation stacked memory strategy. As a Senior Memory Architect, you will define architectures that span die, stack, package, and system, and influence how customers and platforms adopt them. You will lead through technical depth, guide major architectural decisions, and help translate bold ideas into production reality.

Responsibilities

• Define next-generation 3D stacked memory architectures spanning bandwidth, capacity, power efficiency, and RAS
• Lead die-to-system co-optimization across memory die, PHY, TSVs, bonding, packaging, and system integration
• Architect stack-aware RAS, telemetry, and reliability mechanisms for high-density memory systems
• Drive long-range technology strategy for stacked memory and advanced packaging
• Engage deeply with customers, platform partners, and standards bodies to influence system and ecosystem direction

Minimum Qualifications

• Bachelor’s degree or equivalent practical experience in Electrical Engineering, Computer Engineering, Computer Science, or a related field
• Extensive industry experience in stacked memory, 3D integration, advanced packaging, or high-performance semiconductor architecture
• Deep hands-on expertise in high-speed I/O, TSV-based stacking, power delivery, thermals, and signal integrity
• Proven ability to translate system-level requirements into memory and package architecture
• Demonstrated technical leadership across teams and complex architectural decisions

Preferred Qualifications

• Master’s degree or PhD in Electrical Engineering or a related technical field
• Recognized expertise in stacked memory or advanced packaging, internally or externally
• Experience influencing tier-1 customers, platform architects, or industry standards
• Track record of architectural innovations shipped in production silicon or platforms
• Experience mentoring senior engineers or architects

Job Profile(s)

Systems Design Engineering SMTS - Systems Design Engineering SMTS

Relocation Level: TBD

Before Getting Started

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• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

The US base salary range that Micron Technology estimates it could pay for this full-time position is: $177,000.00 – $387,000.00 a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

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