A complete application in a minute
Tailored resume and cover letter, ready to send.
General Dynamics Land Systems offers a Summer 2027 Internship in Michigan, focusing on Sights and Electro-Optical Sensors. Interns work within Engineering on design activities in the Lethality Sensors Hardware area, gaining hands-on experience and mentorship over a 3-month period.
The program embeds students in key functional areas, with compensation based on area of study and class standing, and opportunities for real-world impact as part of a Fortune 100 aerospace and defense leader.
The General Dynamics Land Systems Summer 2027 Internship Program provides an opportunity for students looking to start or continue the transition from academia into industry. Our three-month internship assignments provide compensation based on area of study and class standing, and have the students embedded in key functional areas of our business, getting real-world experience and mentorship from seasoned professionals. As part of your summer experience, you will join our team and use your education, experience, and creativity to make an impact.
This is an internship position within Engineering supporting design activities in the Lethality Sensors Hardware area.
General Dynamics is a successful Fortune 100, global aerospace and defense company, with over 90,000 employees world-wide. General Dynamics Land Systems, a business unit of General Dynamics, has a strong foundation of delivering core engineering and manufacturing capabilities to our clients for military vehicles. Our team is focused on continuous process and productivity improvements that reduce product costs, while increasing troop safety and effectiveness. Land Systems continues to work with the US Armed Forces and its Allies to ensure these vehicles remain survivable, relevant, flexible, affordable and capable of addressing a dynamic threat environment.
Whether you are starting your career or an experienced professional, we offer a Total Rewards package that is impactful and built for you.
Vehicle Harness Design; Siemens Capital suite
Digital and Analog circuit design including power and thermal analysis
Schematic development, component selection, circuit simulation, and PCB layout
Microprocessor-based products including processors, chipsets, memory, and bus interfaces, networking standards (PCI-press, DDR2, DDR3, USB, etc.)
HC12 Microcontroller and x 86 Power PC Single board Computer, FPGA development / experience
Industry interface standards and form factors (VITA 442/446, COM Express, etc.)
Networking products, H/W, S/W, Switches, Routers, OSI Lurers
Network storage (NAS, SAN), Solid State and Rotating Drive Technologies, interfaces, and Protocols
Ethernet Networks and Ethernet network tools (Wireshark)
Serial Interconnects, USB, CAN, RS422, etc...
Graphics/video interfaces (DVI, HDMRI, RS 179, DP, CoaXpress etc...)
Familiarity or experience with controls, controllers, sensors, and/or control logic
Familiarity with Pro Engineer or similar CAD systems
We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
PI287899466