Hardware Design Engineer

VERSOM; Çankaya; On-site; TRY 420,000 - 640,000; Full time

Job summary

VERSOM in Ankara seeks a Hardware Design Engineer with a strong PCB layout focus to transform schematics into high-density, manufacturable PCBs for defense, aerospace, and industrial applications.

You will define stackups, route DDR4/LPDDR4/LPDDR5, PCIe, GTY/GTYP, Ethernet, and USB interfaces, and implement HDI structures, PDNs, and impedance control. Collaboration with fabrication suppliers and SI/PI analyses are core parts of the role.

Qualifications

• Bachelor's or Master's degree in Electrical and Electronics Engineering, Electronics and Communication Engineering, or related field.
• At least 5 years of hands-on PCB layout experience on complex multilayer boards.
• Proficiency in PCB design tools such as Altium Designer, Cadence Allegro, or Siemens Xpedition/PADS.
• Experience with DDR memory interfaces and high-speed serial interfaces (PCIe, GTY/GTYP, Ethernet).
• Experience designing 10+ layer boards, fine-pitch BGA fan-out, and HDI technologies.
• Understanding of impedance, stackups, return paths, crosstalk, EMI/EMC-aware layouts.
• Knowledge of IPC standards and DFM/DFA.
• Experience with manufacturing docs and working with PCB fabrication/assembly suppliers.
• Ability to read schematics and datasheets; strong technical English.

Responsibilities

• PCB component placement and routing for AMD SoC-based SoMs and carrier boards from schematic handoff to release.
• Define PCB stackups and impedance structures with hardware team and PCB vendors.
• Route high-speed interfaces (DDR4, LPDDR4/LPDDR5, PCIe, multi-gigabit transceivers, Ethernet, USB) with length/phase matching.
• Implement fine-pitch BGA fan-out and HDI structures (microvias, blind/buried vias, via-in-pad).
• Design PDNs, planes, and decoupling with PI and thermal considerations.
• Support SI/PI analyses and layout iterations; maintain schematics and footprints.
• Coordinate with mechanical for outlines, connectors, enclosures; exchange STEP/IDF data.
• Prepare Gerber/ODB++ files, drill files, assembly drawings, pick-and-place files, notes.
• Collaborate with PCB fabrication/assembly suppliers and assist prototype bring-up.

Skills

PCB Layout

High-speed design

HDI techniques

DDR4/LPDDR4/LPDDR5 interfaces

PCIe

Ethernet

Altium Designer

Cadence Allegro

Siemens Xpedition/PADS

Signal integrity (SI)

Power integrity (PI)

DFM/DFA principles

Education

Bachelors/Masters in EE or ECE

Tools

Altium Designer

Cadence Allegro

Siemens Xpedition/PADS

Job description

VERSOM is a newly established technology company founded as a joint venture between DEICO and EMPA Electronics, combining their complementary expertise to develop high-performance System-on-Module (SoM) platforms, carrier boards, and embedded computing solutions.

DEICO contributes its engineering expertise in high-speed hardware design, PCB development, electronics manufacturing, and defense and aerospace applications. EMPA brings its extensive technology ecosystem, electronic component sourcing capabilities, global supply chain network, and product lifecycle management expertise. Together, these capabilities provide VERSOM with a strong foundation for developing reliable, high-performance hardware solutions for demanding applications.

We are looking for a Hardware Design Engineer with a strong focus on PCB layout to join our engineering team in Ankara. In this role, you will transform schematics for SoM and carrier board designs into high-density, high-speed, and manufacturable PCBs for defense, aerospace, and industrial applications.

Qualifications

• Bachelor's or Master's degree in Electrical and Electronics Engineering, Electronics and Communication Engineering, or a related engineering discipline.
• At least 5 years of hands-on PCB layout experience involving complex multilayer digital boards.
• Proficiency in PCB design tools such as Altium Designer, Cadence Allegro, or Siemens Xpedition/PADS.
• Practical PCB layout experience with DDR memory interfaces and high-speed serial interfaces, including PCIe, multi-gigabit transceivers, and Ethernet.
• Experience designing boards with 10 or more layers, fine-pitch BGA fan-out, and HDI technologies.
• Solid understanding of controlled impedance, PCB stackup design, return paths, crosstalk, and EMI/EMC-aware layout practices.
• Knowledge of IPC standards and DFM/DFA principles.
• Experience preparing complete manufacturing documentation and working directly with PCB fabrication and assembly suppliers.
• Ability to interpret schematics and component datasheets accurately.
• Good command of technical English.

Key Responsibilities

• Perform PCB component placement and routing for AMD SoC-based (Versal, MPSoC, and Zynq) SoM and carrier boards, from schematic handoff through manufacturing release.
• Define PCB stackups and controlled-impedance structures in collaboration with the hardware engineering team and PCB manufacturers.
• Route high-speed interfaces, including DDR4, LPDDR4/LPDDR5, PCIe, multi-gigabit transceivers (GTY/GTYP), Ethernet, and USB, applying appropriate length and phase matching, differential pair constraints, and reference plane rules.
• Implement fine-pitch BGA fan-out and HDI structures, including microvias, blind and buried vias, and via-in-pad technologies.
• Design power distribution networks (PDNs), plane structures, and decoupling capacitor placement in accordance with power integrity (PI) requirements, considering thermal performance.
• Apply design constraints defined by the hardware engineering team and support signal integrity (SI) and power integrity (PI) analyses, including design iterations and optimization.
• Create and maintain schematic symbols, PCB footprints, and 3D component models in accordance with applicable IPC standards.
• Coordinate with mechanical design engineers on board outlines, connectors, mounting requirements, and enclosure integration, using STEP/IDF data exchange.
• Perform design rule checks (DRC) and design for manufacturing and assembly (DFM/DFA) reviews, and prepare complete manufacturing documentation, including Gerber/ODB++ files, drill files, assembly drawings, pick-and-place files, and fabrication notes.
• Collaborate with PCB fabrication and assembly suppliers, and support prototype bring-up by implementing layout-related fixes and supporting rework activities.

Why Join VERSOM?

• Advanced engineering challenges: Work on high-performance embedded computing platforms and complex, high-speed PCB designs.
• Strong engineering foundation: Benefit from DEICO's hardware engineering, PCB development, and manufacturing expertise.
• Integrated technology ecosystem: Leverage EMPA's component sourcing capabilities, supply chain network, and product lifecycle expertise.
• Meaningful product development: Contribute to the development of SoM and carrier board solutions for demanding defense, aerospace, and industrial applications.
• Opportunity to grow with a new venture: Become part of a growing engineering team building next-generation embedded hardware solutions.

If you are passionate about advanced PCB design and want to contribute to the development of high-performance embedded hardware, we would be pleased to hear from you.