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Micron NAND Technology Integration (NTI) Singapore is seeking a Yield Enhancement Physical Failure Analysis Technician to provide physical failure analysis for next‑generation Micron products. You will identify failure mechanisms and assist with root‑cause analysis for yield issues.
You will work hands‑on with acid hood operation, polish wheel, delayering techniques with wet/dry etch, SEM, dual‑beam FIB, and STEM lamella creation, and help transfer PFA processes into production.
Micron NAND Technology Integration (NTI) Singapore is seeking a Yield Enhancement Physical Failure Analysis Technician to be responsible for providing physical failure analysis for next-generation Micron products. In this meaningful role identification and communication of failure mechanism and assisting with the root cause analysis for yield issues. You will need to be knowledgeable and have hands on experience with physical analysis tools such as but not limit to acid hood operation, polish wheel, delayer techniques with wet/dry etch, SEM, dual beam FIB, and STEM lamella creation. You will also help support the transfer of physical failure analysis processes into production.
ITE or Diploma in an electronics related field or equivalent experience