Technical Project/ Program Manager (Advanced Packaging)

Applied Materials South East Asia Pte Ltd; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading innovation-driven company seeks a Project Manager to guide complex semiconductor packaging projects within its Advanced Packaging Development Center. The ideal candidate will demonstrate significant experience in project management, communication, and technical expertise in semiconductor technologies, while fostering collaboration across multifunctional teams in a dynamic work environment.

Qualifications

• Technically experienced in semiconductor advanced packaging technologies.
• Relevant project management experience.
• Ability to communicate with various stakeholders.

Responsibilities

• Develops project plans and manages their implementation.
• Oversees resources and drives project performance objectives.
• Interfaces with customers to define objectives and provide updates.

Skills

Project management

Communication

Organization

Problem-solving

Education

Engineering degree

Tools

Project management software

Job description

Applied Materials is an innovation-driven company. We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our ability to identify emerging technologies that can complement and leverage Applied’s materials engineering expertise is critical to the company’s continued growth. To accelerate our growth programs, Applied Materials fosters a vibrant innovation network of academics, researchers, government organizations, commercial partners and entrepreneurs in the ecosystems we operate in.

The Advanced Packaging Development Center is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL),TSVandhybrid bonding.

Key Responsibilities

• Develops project plan and oversees from conception and planning to implementation, including strategies, processes and resources. Ensures objectives are clearly defined and agreed to across the business unit.

• Responsible for managing schedule and task details by utilizing project management tools such as reports, tracking charts, checklist and project scheduling software.

• Drives allocated resources from other organizations to achieve on-time and within budget performance objectives for the project. Initiates and manages capital allocation requests, purchase requisitions, and purchase orders.

• Manages cost schedule performance of equipment for internal and external customers and vendors worldwide.

• Leads multifunctional design teams comprised of internal, external and/or matrixed headcount to complete project/program. Provides technical leadership to team members to achieve goals.

• Interfaces and coordinates with customers to define objectives, provide status updates and prepare for release and deployment.

• Provides engineering and business process expertise to team and other members on various significantly complex programs/issues.

• Identifies and resolves potential complications within the program and develops solutions for resolution.

Requirements

• Technically experienced and competent in semiconductor advanced packaging technologies

• Relevant project management experiences and education qualification in Engineering studies

• Ability to effectively communicate with various stakeholders and build strong working relationships

• Ability to manage multiple tasks, prioritize effectively, and stay organized

• Ability to accommodate to meetings of different time zone (especially USA)

• Ability to travel for work when required

Work Location

• Science Park II