TCB (Thermo Compression Bonding) Process Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A recruitment firm in Singapore is seeking a TCB Process Engineer to develop and optimize bonding processes in semiconductor packaging. The ideal candidate has a relevant degree and 2-5 years of experience with TCB or similar technologies. Responsibilities include troubleshooting bonding issues, maintaining process documentation, and collaborating with vendors to ensure quality. This role offers a competitive salary based on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging.
• Experience with TCB or similar bonding technologies highly preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Evaluate new materials and bonding tools.
• Troubleshoot yield issues related to TCB bonding.
• Define and maintain process documentation and SOPs.

Skills

Experience with TCB bonding technologies

Strong problem-solving skills

Data analysis and DOE

Knowledge of semiconductor packaging

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, or Electrical Engineering

Job description

Overview

Position title: TCB (Thermo Compression Bonding) Process Engineer

Location: North

Working Days: 5 Day A Week

Working hours: 9:00am - 6:00pm

Salary: $5000 - $8000 (depends experience)

Interested applicants can also send your resume to WA:[phone] (Ms Angel) and allow our Consultant to match you with our Clients.

No Charges will be incurred by Candidates for any service rendered.

LIEW ONN KEE REG NO : R22108518

THE SUPREME HR ADVISORY EA NO:14C7279

Responsibilities

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.