TCB Process Engineer |Thermo Compression Bonding - SS10

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading company in the semiconductor industry is seeking a TCB Process Engineer to develop and optimize bonding processes. This role requires a Bachelor's or Master's in a related field and 2-5 years of experience in semiconductor packaging. You will troubleshoot yield issues, collaborate with vendors, and ensure process stability while maintaining compliance with health and safety standards.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies is highly preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Troubleshoot yield issues related to TCB bonding.
• Conduct DOE and data analysis for process improvements.

Skills

Process Optimization

Troubleshooting

Data Analysis

Collaboration

Compliance

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field

Job description

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: #01-10 Admirax St
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Samuel Siaw

The Supreme HR Advisory Pte Ltd

EA No: 14C7279

Reg No: R24124745