TCB Bonding Process Engineer [ Semiconductor industry / Up to $8k ] - 8890

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading recruitment agency seeks a TCB (Thermo Compression Bonding) Process Engineer to develop and optimize bonding processes. The role involves troubleshooting yield issues, conducting experiments, and collaborating with teams to improve manufacturing reliability. Candidates must hold a relevant degree and have 2-5 years of experience in semiconductor packaging, with a preference for knowledge in bonding technologies.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies is highly preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Troubleshoot yield issues related to TCB bonding.
• Conduct DOE and data analysis to drive process improvements.

Skills

Hands-on experience in TCB processes

Troubleshooting skills

Data analysis

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Job description

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: Admirax St
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Interested Personal kindly contact WhatsApp :[phone](Lydia)

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The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279