Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor firm in Singapore is seeking a fab engineer to optimize processes and improve product quality. The role involves establishing and enhancing process capabilities, troubleshooting fabrication issues, and collaborating with teams to enhance yield. Applicants should have a BS, MS, or PhD in relevant fields, along with at least 5 years of experience in the semiconductor industry. Strong knowledge of DRAM/NAND memory technologies is essential. This position offers an opportunity to lead critical improvements in semiconductor manufacturing.

Qualifications

• Minimum of 5 years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
• In-depth knowledge of DRAM/NAND memory processes and reliability issues.
• In-depth knowledge of memory processes and yield issues.

Responsibilities

• Establish and improve process condition and technology.
• Upgrade process capability and reduce production cost.
• Troubleshoot wafer fabrication problems.
• Conduct research to recommend process improvements.

Skills

Yield enhancement

Process integration

Problem-solving

Root cause analysis

SPC Methodology

Root Cause Analysis

Education

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, or Material Science

Job description

Overview

As a Fab Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. This position will identify, diagnose and resolve process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities

• Establish and improve process condition and technology.
• Upgrade process capability and reduce production cost.
• Establish and modify process management projects.
• Set up process parameters for a variety of semiconductor equipment.
• Evaluation, promotion and planning of new equipment / materials.
• Abnormal analysis and improvement.
• Maximizes yield by working on tools, the process, or wafer fabrication recipes.
• Troubleshoots wafer fabrication problems and performs root cause analysis.
• Works with other process areas to understand and control process deviations.
• Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas.
• Evaluates products to ensure they meet the required design and performance specifications.
• Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Requirements

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
• Minimum of 5 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new DRAM/NAND memory technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with memory DRAM/NAND along with good understanding of the process flow, the interaction of process & device, common yield & reliability issues are desirable.