Staff Engineer, NAND TD, RDA

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 100,000 - 140,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is looking for an RDA Lead to manage and execute RDA strategy for NAND TD technologies in Singapore. This role requires extensive experience in semiconductor manufacturing along with strong leadership capabilities to drive continuous improvement and mentor engineers.

The ideal candidate will possess a Bachelor’s degree and significant experience in defect analysis and inspection technologies, focusing on reducing yield loss and enhancing operational success. Collaboration with global teams is crucial.

Qualifications

• Bachelor’s degree with 7+ years relevant semiconductor experience or Master’s/PhD with 5+ years.
• Minimum 1 year of hands-on RDA experience in semiconductor manufacturing or equipment engineering.
• Demonstrated expertise in defect inspection, process monitoring, and yield learning.

Responsibilities

• Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.
• Lead analysis of experimental and production flows to detect and classify defects.
• Establish and report program health metrics.
• Direct fast containment for defect excursions and trigger corrective actions.
• Mentor engineers and develop technical ladders within RDA.

Skills

Defect inspection

Statistical data analysis

Root cause analysis

Leadership

Semiconductor process integration

Education

Bachelor's degree in relevant field with 7+ years experience or Master's/PhD with 5+ years

Tools

RDA systems

Optical inspection technologies

e-beam inspection technologies

Job description

Micron is seeking a RDA Lead to own and drive the RDA strategy and execution for NAND TD technologies.

Required Responsibilities

• Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.
• Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.
• Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).
• Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.
• Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.
• Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.
• Influence supplier roadmaps; evaluate, qualify, and release next‑gen optical/e‑beam inspection capabilities.
• Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.
• Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.
• Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.

Key Responsibilities

• Serve as the technical lead for RDA methodologies and execution within NAND TD.
• Perform root cause analysis using statistical, image-based, and data-driven techniques.
• Develop, own, and communicate inspection and defect detection technology roadmaps.
• Define program health metrics and drive continuous improvement initiatives (CIP).
• Lead tool anomaly investigations, quarantine decisions, and corrective action planning.
• Collaborate globally to align Best Known Methods (BKM) across sites.

Stakeholder Collaboration

• Technology Development (TD) Process and Integration teams
• Yield Analysis and Data Science organizations
• Global Manufacturing and Operations
• Inspection/metrology equipment suppliers
• Program and engineering leadership across regions

Requirements

• Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years.
• Minimum 1 year of hands‑on RDA experience in semiconductor manufacturing or equipment engineering.
• Demonstrated expertise in defect inspection, process monitoring, and yield learning.

Technical Competencies

• Realtime Defect Analysis (RDA) systems and workflows.
• Optical and e‑beam inspection technologies.
• Statistical data analysis, correlation development, and large dataset interpretation.
• Semiconductor process integration and technology development.
• Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).

Leadership & Behavioral Competencies

• Recognized technical authority with the ability to influence without direct authority.
• Strong mentoring and coaching mindset with proven talent development outcomes.
• Clear, concise communication skills across technical and executive audiences.
• Ownership‑driven, execution‑focused; comfortable operating in ambiguity.

Impact & Success Measures

• Reduced defect‑related yield loss and faster learning cycles.
• On‑time qualification and adoption of next‑generation inspection capabilities.
• Uplift in organizational RDA skill depth and succession pipeline.
• Alignment of inspection strategy and capability to future NAND nodes.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.