Staff Engineer, NAND TD, RDA

Micron Technology; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

Micron Technology in Singapore is seeking a skilled candidate to lead RDA methodologies and execution within NAND TD. The successful applicant will perform root cause analysis and establish inspection metrics while mentoring engineers and collaborating with global teams to standardize practices.

The ideal candidate must possess a Bachelor's degree with significant semiconductor experience, or a Master’s/PhD with relevant experience. Strong communication skills and a focus on execution are essential for this role.

Qualifications

• 7+ years of semiconductor experience or equivalent Master’s/PhD with 5+ years.
• At least 1 year of hands-on RDA experience in semiconductor manufacturing.
• Expertise in defect inspection and yield learning.

Responsibilities

• Lead exploration of defect analysis strategies.
• Establish program health metrics and improvement initiatives.
• Mentor engineers and drive safety initiatives.

Skills

Real-time Defect Analysis

Statistical data analysis

Defect inspection expertise

Process monitoring

Root cause analysis

Education

Bachelor's degree in relevant field with 7+ years of experience

Master's/PhD with 5+ years of relevant experience

Tools

Optical inspection technologies

E-beam inspection technologies

Job description

Required Responsibilities

• Own the site‑level RDA strategy and annual roadmap aligned to NAND TD technology nodes.
• Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.
• Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).
• Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.
• Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.
• Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.
• Influence supplier roadmaps; evaluate, qualify, and release next‑gen optical/e‑beam inspection capabilities.
• Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.
• Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.
• Champion safety and continuous improvement (CIP); drive Kaizen/lean initiatives that improve cycle time and learning velocity.

Key Responsibilities

• Serve as the technical lead for RDA methodologies and execution within NAND TD.
• Perform root cause analysis using statistical, image‑based, and data‑driven techniques.
• Develop, own, and communicate inspection and defect detection technology roadmaps.
• Define program health metrics and drive continuous improvement initiatives (CIP).
• Lead tool anomaly investigations, quarantine decisions, and corrective action planning.
• Collaborate globally to align Best Known Methods (BKM) across sites.

Stakeholder Collaboration

• Technology Development (TD) Process and Integration teams
• Yield Analysis and Data Science organizations
• Global Manufacturing and Operations
• Inspection/metrology equipment suppliers
• Program and engineering leadership across regions

Requirements

• Bachelor’s degree with 7+ years of relevant semiconductor experience, or Master’s/PhD with 5+ years.
• Minimum 1 year of hands‑on RDA experience in semiconductor manufacturing or equipment engineering.
• Demonstrated expertise in defect inspection, process monitoring, and yield learning.

Technical Competencies

• Real‑time Defect Analysis (RDA) systems and workflows.
• Optical and e‑beam inspection technologies.
• Statistical data analysis, correlation development, and large dataset interpretation.
• Semiconductor process integration and technology development.
• Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).

Leadership & Behavioral Competencies

• Recognized technical authority with the ability to influence without direct authority.
• Strong mentoring and coaching mindset with proven talent development outcomes.
• Clear, concise communication skills across technical and executive audiences.
• Ownership‑driven, execution‑focused; comfortable operating in ambiguity.

Impact & Success Measures

• Reduced defect‑related yield loss and faster learning cycles.
• On‑time qualification and adoption of next‑generation inspection capabilities.
• Uplift in organizational RDA skill depth and succession pipeline.
• Alignment of inspection strategy and capability to future NAND nodes.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.