Staff Engineer (Assembly Process Development / Co-Packaged Optics)

Dynamic Human Capital Pte Ltd; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading company in the optical engineering field is seeking a highly skilled professional to lead process development and optimization for optical coupling projects. This role requires a strong background in electrical or electronic engineering, with significant hands-on experience in assembly processes. The successful candidate will also work closely with machine vendors for enhancements and implement testing procedures for optical assemblies.

Qualifications

• 5+ years in assembly processes.
• Knowledge of flip-chip packages and die bonding.
• Experience with 3D printing of polymers is a plus.

Responsibilities

• Lead optimization of FAU attach process.
• Operate active alignment machine for precision tasks.
• Develop tooling for new optical products.

Skills

Process development

Optical alignment

Root-cause analysis

Data collection

Troubleshooting

Education

Degree / Masters in Electrical/Electronic Engineering

PhD in relevant field

Job description

Job Responsibilities:

• Lead process development and optimization of FAU attach process including both passive and active alignment, epoxy dispensing, FAU bonding and UV/thermal curing process.

• Must be able to do hands-on and operate active alignment machine for sub-micron precision alignment and coupling process, epoxy dispensing and curing process.

• Support data collection, root-cause analysis and yield improvement efforts related to optical coupling, FAU to Receptacle optical coupling repeatability test and FAU attach process issues.

• Performs all hands-on machine operation, troubleshooting, calibration and maintenance of active alignment bonder.

• Introduce and evaluate new gripper/pickup tool design (e.g. pickup gripper), fixture design and other tooling necessary to develop new optical product.

• Create process FMEA and process control specification.

• Work closely with machine vendors to further modify and improve existing machine capability and features to better support CPO related projects

• Design and implement optical test tooling and procedures to quantify coupling loss of FAU coupled OE/CPO packages/assemblies

Requirements:

• Degree /Masters in Electrical/Electronic Engineering. PhD is a plus.

• At least 5 years of working experience in assembly processes.

• Excellent knowledge and experience in flip-chip package development, wire bond, die attach, FAU attach and substrate review.

• Excellent understanding of optical alignment principles, FAU to PIC chip coupling methodology (edge and grating), epoxy material properties and selection criteria and die bonding process development knowledge.

• Prior knowledge and experience in 3D printing of polymer/resin material is an added advantage.

We would like to invite interested applicants to apply.

Thomas Tan Teck Nang

Dynamic Human Capital Pte Ltd

Registration No: 12C6253

License No: R2094900

By submitting an application or your resume, you are deemed to have consented to Dynamic Human Capital Pte Ltd collecting, using and disclosing your personal data for the purposes stated in our privacy notice (https://dhc.com.sg/privacy-policy). You acknowledge that you have read, understood, and agree with the terms in our privacy notice.

Under the revised Employment Agencies Licence Condition 5(b), employment agencies (EAs) are required to collect the personal data (e.g. NRIC, FIN) of applicants referred to employers for permanent or contract job positions of at least 6 months with a fixed monthly salary of $3,300 and above. PDPA requirements on collection, use and disclosure of personal data are not applicable to EAs that are collecting such information, as it is a regulatory requirement.

https://www.mom.gov.sg/faq/submit-quarterly-referral-and-placement/are-employment-agencies-allowed-to-collect-personal-data