Staff Engineer

Dynamic Human Capital Pte Ltd; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading company in optical technology is seeking a skilled process developer. The ideal candidate will have extensive experience in assembly processes and a solid educational background in Electrical/Electronic Engineering. The role involves hands-on machine operation, process optimization, and collaboration with machine vendors to enhance project outcomes, offering opportunities for professional growth.

Qualifications

• At least 5 years of working experience in assembly processes.
• Excellent knowledge in optical alignment and epoxy properties.
• Experience with 3D printing of polymer materials is an advantage.

Responsibilities

• Lead process development for FAU attach process and handle machine operations.
• Support data collection and root-cause analysis related to optical coupling.
• Create process specifications and improve machine capabilities.

Skills

Optical alignment principles

Epoxy material properties

Flip-chip package development

Die attach

3D printing of polymer

Education

Degree/Masters in Electrical/Electronic Engineering

PhD in relevant field

Job description

Job Responsibilities:

· Lead process development and optimization of FAU attach process including both passive and active alignment, epoxy dispensing, FAU bonding and UV/thermal curing process.

· Must be able to do hands-on and operate active alignment machine for sub-micron precision alignment and coupling process, epoxy dispensing and curing process.

· Support data collection, root-cause analysis and yield improvement efforts related to optical coupling, FAU to Receptacle optical coupling repeatability test and FAU attach process issues.

· Performs all hands-on machine operation, troubleshooting, calibration and maintenance of active alignment bonder.

· Introduce and evaluate new gripper/pickup tool design (e.g. pickup gripper), fixture design and other tooling necessary to develop new optical product.

· Create process FMEA and process control specification.

· Work closely with machine vendors to further modify and improve existing machine capability and features to better support CPO related projects

· Design and implement optical test tooling and procedures to quantify coupling loss of FAU coupled OE/CPO packages/assemblies

Requirements:

· Degree /Masters in Electrical/Electronic Engineering. PhD is a plus.

· At least 5 years of working experience in assembly processes.

· Excellent knowledge and experience in flip-chip package development, wire bond, die attach, FAU attach and substrate review.

· Excellent understanding of optical alignment principles, FAU to PIC chip coupling methodology (edge and grating), epoxy material properties and selection criteria and die bonding process development knowledge.

· Prior knowledge and experience in 3D printing of polymer/resin material is an added advantage.

We would like to invite interested applicants to apply.

Thomas Tan Teck Nang

Dynamic Human Capital Pte Ltd

Registration No: 12C6253

License No: R2094900

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