(Sr.) Tape Out Engineer

NXP Semiconductors NV; Singapore; On-site; SGD 90,000 - 180,000; Full time

Job summary

NXP Semiconductors NV in Singapore is seeking a Tape Out Engineer to oversee the final tape-out stage of IC designs, ensuring precision and conformance to manufacturing requirements. You will liaise with design, technologists, program managers, and manufacturing teams to resolve issues and optimize outcomes.

The role emphasizes accuracy, attention to detail, and the ability to work under tight deadlines, with flexible hours to support critical tape-outs and timely product launches.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field.
• Experience with physical design tools (Cadence, Synopsys) and semiconductor manufacturing workflows.
• Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.
• Willingness to work with flexible working hours to support critical Tape-outs.

Responsibilities

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
• Work with cross-functional teams to resolve technical issues and optimize designs for manufacturability.
• Ensure all deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Skills

Attention to detail

Problem-solving

Communication in English

Deadline-driven

Team collaboration

Education

Bachelor’s degree in Electrical/Computer Engineering

Master’s degree preferred

Tools

Cadence

Synopsys

Job description

Tape Out Engineer Job Description

Role Overview, Responsibilities, and Qualifications

The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.

Key Responsibilities

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
• Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability.
• Ensure all deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred).
• Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows.
• Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.
• Willingness to work with flexible working hours to support critical Tape-outs.
• Effective communication in English for collaborating across technical teams.

This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

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