Sr. Tape Out Engineer

NXP Semiconductors Singapore Pte Ltd; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

NXP Semiconductors Singapore is seeking a Tape Out Engineer to oversee the final design checkpoint before fabrication, ensuring data meets manufacturing requirements and quality standards. You will work with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.

You will coordinate the tape out process, verify design integrity, and ensure all deliverables conform to foundry requirements, while maintaining thorough records for future

Qualifications

• Bachelor's degree required in EE/CE or related field.
• Master’s degree preferred.
• Experience with physical design tools and manufacturing workflows.
• Strong attention to detail and problem-solving.
• Fluency in English and ability to work with global teams.

Responsibilities

• Coordinate and execute tape out process for semiconductor products.
• Verify design integrity by reviewing database and documentation.
• Collaborate with cross-functional teams to resolve issues and optimize manufacturability.
• Ensure deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures and outcomes.

Skills

Attention to detail

Problem-solving

Deadline pressure

English communication

Flexible hours

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering or related field

Master’s preferred

Tools

Cadence

Synopsys

Job description

Tape Out Engineer Job Description

Role Overview, Responsibilities, and Qualifications

The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes.

Key Responsibilities

• Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
• Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability.
• Ensure all deliverables conform to foundry requirements.
• Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred).
• Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows.
• Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines.
• Willingness to work with flexible working hours to support critical Tape-outs.
• Effective communication in English for collaborating across technical teams.

This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

More information about NXP in Singapore...