SR ENGINEER, PDE METRO RDA

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

8 days ago

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Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an experienced professional to own inspection and metrology platforms across packaging development and manufacturing. You will lead technology roadmaps, data-driven improvements, and cross-functional collaboration to drive manufacturing excellence.

The role focuses on advancing defect detection, AI-enabled analytics, and scalable tool deployment, with emphasis on NPI readiness, supplier engagement, and global program leadership.

Qualifications

  • Bachelor's degree in Engineering or equivalent.
  • Deep understanding of semiconductor equipment performance, process integration, and manufacturing operations.
  • Experience driving equipment qualifications, technology transfers, and ramp readiness.
  • Strong supplier management and collaborator engagement skills.
  • Demonstrated ability to influence technical strategy across multiple organizations and sites.
  • Strong communication, problem-solving, and executive presentation skills.
  • Ability to operate effectively in highly matrixed global organizations.
  • Leveraging AI, analytics, and automation to drive manufacturing excellence and efficiency.

Responsibilities

  • Manage advanced inspection and metrology platforms throughout package development and manufacturing.
  • Develop technology roadmaps and capability strategies to meet future packaging requirements.
  • Drive equipment lifecycle management, capacity planning, and technology insertion activities.
  • Lead tool installation, qualification (TIQ), release, and production readiness activities.
  • Establish equipment acceptance criteria, qualification methodologies, and deployment plans.
  • Drive tool-to-tool matching and network standardization initiatives.
  • Develop inspection solutions to detect, monitor, and reduce critical defect mechanisms.
  • Set up defect metrics, observation methods, and continuous advancement plans.
  • Manage MRDA data systems and engineering applications for Advanced and Conventional Packaging.
  • Enable integration of inspection, metrology, manufacturing, and quality data for defect traceability.

Skills

Engineering leadership
Project management
Communication skills
Data analytics
AI/automation

Education

Bachelor's degree in Engineering

Job description

Inspection Technology & Equipment Ownership
  • Manage advanced inspection and metrology platforms throughout package development and manufacturing.

  • Develop technology roadmaps and capability strategies to meet future packaging requirements.

  • Drive equipment lifecycle management, capacity planning, and technology insertion activities.

  • Equipment Qualification & Deployment

  • Lead tool installation, qualification (TIQ), release, and production readiness activities.

  • Establish equipment acceptance criteria, qualification methodologies, and deployment plans.

  • Drive tool-to-tool matching and network standardization initiatives.

Defectivity Engineering & Yield Improvement
  • Develop inspection solutions to detect, monitor, and reduce critical defect mechanisms.

  • Set up defect metrics, observation methods, and continuous advancement plans.

Data Analytics & Digital Transformation
  • Manage and improve MRDA data systems and engineering applications related to Advanced Packaging and Conventional Packaging technologies.

  • Enable seamless integration of inspection, metrology, manufacturing, and quality data for defect traceability and analysis.

  • Drive development of dashboards, analytics platforms, and automated workflows to support operational and engineering excellence.

  • Establish data governance, standards, and guidelines to ensure scalable and reliable MRDA solutions across the network.

  • Leverage advanced analytics and AI technologies to improve defect detection, prediction, and process control efficiency.

Technology Development & NPI Readiness
  • Support technology development programs in HBM, Advanced Packaging, and Conventional Packaging.

  • Ensure inspection and metrology tool readiness for NPI, pilot builds, and manufacturing ramps.

Supplier & Industry Engagement
  • Collaborate with equipment suppliers to resolve technical issues and improve tool performance.

  • Evaluate and introduce next-generation inspection technologies and solutions.

  • Lead technical reviews, address blocking issues, and manage ongoing improvement initiatives with suppliers.

Cross-Functional Leadership & Program Management
  • Partner with Process, Equipment, Manufacturing, Quality, Automation, and Global Engineering teams.

  • Lead project execution, risk management, and achievement delivery for central initiatives.

  • Influence collaborators and drive alignment across sites and organizations.

Requirements
  • Bachelor's Degree or equivalent experience in Engineering (Electrical, Mechanical, Mechatronics, Materials, Chemical Engineering, or related field).

  • Deep understanding of semiconductor equipment performance, process integration, and manufacturing operations.

  • Experience driving equipment qualifications, technology transfers, and manufacturing ramp readiness.

  • Strong supplier management and collaborator engagement skills.

  • Demonstrated ability to influence technical strategy across multiple organizations and sites.

  • Strong communication, problem-solving, and executive presentation skills.

  • Ability to operate effectively in highly matrixed global organizations.

  • Leveraging AI, analytics, and automation to drive manufacturing excellence and efficiency.

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