SENIOR/STAFF ENGINEER, TEST SOLUTIONS ENGINEERING

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 75,000 - 95,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a Senior/Staff Test Solutions Engineer (HBM Probe) to take full ownership of probe test solutions for High Bandwidth Memory (HBM) devices. The role involves developing, debugging, and delivering test solutions across the product lifecycle.

The ideal candidate will have experience in semiconductor test engineering, strong analytical and problem-solving skills, and a Bachelor’s degree in Electrical or Electronics Engineering. This position offers opportunities for mentoring and cross-functional leadership.

Qualifications

• Hands-on experience in semiconductor test engineering, preferably in wafer/cube probe or ATE environments.
• Strong analytical thinking, problem-solving, and silicon debug capabilities.
• Proven ability to take ownership and drive results in a cross-functional environment.

Responsibilities

• Own end-to-end development and delivery of wafer/cube probe test solutions for HBM devices.
• Drive alignment across Design, DFT, Product Engineering, and Manufacturing to resolve probe-related challenges.
• Mentor engineers and elevate team capability in probe test development and data analysis.

Skills

Semiconductor test engineering

Problem-solving

Analytical thinking

Data-driven decision making

Education

Bachelor’s degree in Electrical or Electronics Engineering or equivalent

Job description

Senior/Staff Test Solutions Engineer (HBM Probe)

As a Senior/Staff Test Solutions Engineer (HBM Probe) at Micron, you will take full ownership of developing, debugging, and delivering wafer/cube probe test solutions for High Bandwidth Memory (HBM) devices across the product lifecycle—from new product introduction (NPI) through high‑volume manufacturing (HVM). You are expected to drive fast learning cycles during early silicon, ensure probe readiness for downstream processes, and deliver test solutions that meet aggressive targets on yield, quality, and cost.

Job Responsibilities

• HBM Probe Test Development & Ownership: Own end‑to‑end development and delivery of wafer/cube probe test solutions for HBM devices; define and drive probe test plans, including coverage strategy, defect screening, and test time targets; develop, debug, and release ATE test programs with full accountability for quality and manufacturability; ensure test solutions are robust, scalable, and aligned to NPI and production requirements.
• Silicon Debug & Root Cause Closure: Take ownership of complex wafer/cube probe failures and drive deep debug across silicon, test program, and hardware domains; lead root cause analysis using data, failure signatures, and cross‑domain insights; drive end‑to‑end issue closure, ensuring corrective actions are validated and sustained in production.
• Data Analysis, Yield & Learning Acceleration: Own probe data analysis to identify yield gaps, parametric shifts, and defect mechanisms; drive fast learning cycles by converting probe insights into actionable improvements for downstream processes; make data‑driven decisions to optimize test coverage, guardbands, and release readiness.
• NPI Execution & Production Readiness: Own probe bring‑up for first silicon and drive readiness for characterization and qualification; ensure smooth transition of probe solutions into downstream flows and high‑volume manufacturing; proactively identify risks and gaps and drive mitigation plans to meet program milestones.
• Probe Hardware & System Accountability: Own interaction between probe test programs and hardware (probe cards, load boards, probers); drive resolution of hardware‑software interaction issues impacting stability, accuracy, and throughput; ensure probe setups are optimized and validated for both engineering and production usage.
• Cost, Test Time & Efficiency Delivery: Take ownership of probe test time and cost targets, driving continuous optimization without compromising quality; balance coverage vs. efficiency trade‑offs and make decisions aligned to product and business needs; identify and implement innovations to improve probe productivity and cost effectiveness.
• Cross‑Functional Leadership: Drive alignment across Design, DFT, Product Engineering, and Manufacturing to resolve probe‑related challenges; influence early design and testability decisions to improve overall product quality and test efficiency; act as a key technical point of contact, ensuring clear communication and decisive execution across global teams.
• Technical Leadership & Capability Building: Mentor engineers and elevate team capability in probe test development, debug methodologies, and data analysis; drive adoption of best‑known methods (BKMs) and standardization of probe practices; share technical learnings and insights to strengthen organizational knowledge and execution.

Requirements

• Bachelor’s degree in Electrical or Electronics Engineering (or equivalent).
• Hands‑on experience in semiconductor test engineering, preferably in wafer/cube probe or ATE environments.
• Strong foundation in product testing and semiconductor fundamentals.
• Experience in memory products (e.g., HBM, DRAM) or high‑speed digital devices.
• Strong analytical thinking, problem‑solving, and silicon debug capabilities.
• Experience in test program development, debug, and data‑driven decision making.
• Proven ability to take ownership and drive results in a cross‑functional, fast‑paced environment.
• Experience in NPI, characterization, and production ramp execution.

Equal Opportunity Employer

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.