Senior Scientist (Far BEOL – Advanced Process Modules), IME

Candidate will be part of Far-Backend of Line (Far-BEOL) process module team, advancing specialty microelectronics technologies at IME. His or her main roles and responsibilities include:

1. Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion/hybrid/thermocompression/eutectic bonding for photonics heterogeneous integration and advanced packaging applications.
2. Lead module loop integration for layer transfer of III-V and other compound materials through C2W bonding and post processing.
3. Deliver innovations involving process methodologies, materials, or approaches, and generate intellectual property related to various aspects of heterogeneous integration platforms.
4. Participate in discussions with industry partners to align and develop the building blocks required for next generation heterogeneous integration platforms, including equipment capabilities.
5. Participate as team member with process integration teams to actively innovate and support bonding process optimization and process troubleshooting for various industry and grant projects.
6. Lead and support competitive grant research project proposals and execution of these projects.
7. File patents/know-hows on new development activities.
8. Actively document and publish research findings in prestigious journals and conferences.

Job Requirement:

1. PhD with specialization in Electronic / Microelectronics / Material Engineering / Material Science/ Chemistry / Physics or equivalent.
2. 5 years of industry experience in 3D heterogeneous integration and wafer bonding technologies, either in an academic or industrial setting.
3. Prior hands-on experience in wafer bonding with in-depth technical knowledge in at least one or more bonding processes and mechanisms (vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding) is required.
4. Knowledge of silicon photonics, or 3D heterogeneous integration technology platforms is preferred.
5. Strong experimental design (DOE) and data analysis skills are preferred.
6. Good interpersonal skills and strong demonstrated skills in collaborating with internal and external stakeholders.
7. At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred.
8. Good oral and written communication skills, with the ability to deliver clear and concise messages to both internal and external stakeholders.
9. Self-driven with strong interest in next-generation applications of wafer bonding technologies and industry trends.