Senior R&D Process Engineer (Plasma Etch)

adecco personnel pte ltd; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Adecco Personnel Pte Ltd is seeking a senior candidate to join their R&D team focused on plasma processing technologies for semiconductor equipment. You will lead development, optimize etch and deposition processes, and work across chemistry concepts, validation, and performance testing.

The role requires a Masters or PhD in Chemical Engineering or Materials Science and 5+ years in related field, with strong problem-solving and communication skills.

Qualifications

• Master's or PhD in Chemical Engineering, Materials Science or closely related field.
• Strong command of data analysis and communication skills.
• Experience applying structured problem-solving (Root Cause Analysis, Six Sigma, 5 Whys).

Responsibilities

• Lead development and optimization of plasma processes for etch and deposition applications.
• Define process envelopes, qualification standards, and operating conditions for advanced equipment.
• Collaborate with external suppliers and internal teams to improve hardware performance and reliability.
• Explore new chemistries and process architectures to meet roadmap goals.
• Conduct data-driven experiments and root cause analyses for process variability and defects.
• Assess materials and precursors for integration into manufacturing processes.
• Support cost reduction and productivity through continuous process optimization.
• Engage cross-functionally with engineering, software, and product teams.

Skills

Plasma processing

Semiconductor equipment

Data-driven experimentation

Root Cause Analysis

Education

Master's degree in Chemical Engineering

PhD in Materials Science or related field

Tools

SEM

Film thickness / stress measurement

Plasma diagnostic tools

OES

Job description

The Opportunity:

You will be joining a reputable semiconductor OEM company in their R&D team, supporting and improving existing semiconductor plasma processing equipment products and developing new products with emphasis on C&F (concept & feasibility) activities from new process concept proposal, validation, recipe formulation, and performance testing.

The Job:

• Lead the development and optimization of plasma process technologies to achieve critical performance objectives across etch and deposition applications.
• Define process envelopes, qualification standards, and operating conditions for advanced semiconductor equipment platforms.
• Work alongside external suppliers and internal stakeholders to improve the performance and reliability of process-sensitive hardware components.
• Investigate new chemistry formulation strategies and process architectures to enable future technology roadmap requirements.
• Conduct data-driven experimentation and root cause analysis to address process variability, defect generation, and equipment performance issues.
• Assess emerging materials and precursors for integration into advanced manufacturing processes and applications.
• Apply process characterization techniques and diagnostic methodologies to understand plasma behavior and strengthen process control.
• Support manufacturing cost reduction and productivity enhancement efforts through continuous process optimization initiatives.
• Engage cross-functionally with engineering, software, and product teams to execute development programs and deliver customer-focused solutions.

The Talent:

• Masters or PhD in Chemical Engineering, Material Science or a closely related field with at least 5 years of relevant industry or academic experience.
• Strong oral and written communication abilities, with the capability to present complex ideas clearly and effectively.
• Demonstrated experience in applying structured problem-solving tools and methodologies (e.g., Root Cause Analysis, Six Sigma, Fish bone Diagram, 5 Whys).
• Familiar with semiconductor process and characterization tools (e.g. SEM, film thickness/stress measurement, plasma diagnostic tools, OES) will be a plus
• Familiar with material properties, thin film characterization, and plasma chemistry dynamics
• Hands-on skills in wafer handling, chamber maintenance, manual tool operation, and basic mechanical/gas-line assembly will be a plus