Senior/Principal Scientist and Module Lead – (Far BEOL - APM), NSTIC, IME

Agency for Science, Technology and Research (A*STAR); Singapore; On-site; USD 80,000 - 150,000; Full time

Job summary

An established industry player is seeking a driven leader to guide a team of experts in advanced semiconductor technologies. This pivotal role involves spearheading innovations in Backend of Line (BEOL) processes, ensuring high-quality solutions for diverse customer needs. With a focus on collaboration and strategic foresight, the successful candidate will navigate complex projects, driving advancements in areas such as electroplating and wafer bonding. If you're passionate about shaping the future of semiconductor technologies and thrive in dynamic environments, this opportunity is perfect for you.

Qualifications

• PhD with specialization in relevant engineering fields.
• 8+ years in semiconductor industry process engineering.

Responsibilities

• Lead a team to innovate in BEOL unit processes.
• Develop solutions to meet internal and external customer needs.

Skills

Process Engineering

Team Leadership

Project Management

Analytical Thinking

Interpersonal Skills

Education

PhD in Electrical & Electronics Engineering

PhD in Microelectronics

PhD in Chemical Engineering

PhD in Materials Science

Job description

Job Description:
Advanced Process Modules is a central technology development team providing next-generation unit process solutions to advance specialty technology programs at IME including Advanced Packaging, Micro Electro Mechanical systems, Photonics & Sensors, SiC, and GaN. The candidate will lead a team of research scientists and engineers specializing in Backend of Line (BEOL) unit processes including electroplating, chemical mechanical planarization (CMP), permanent wafer-to-wafer/chip-to-wafer bonding (fusion/hybrid/thermocompression/eutectic bonding) and temporary bonding.

His or her main roles and responsibilities will include the following:

Lead team to deliver innovations involving process methodologies, materials, or approach, and capture intellectual property related to various aspects of BEOL unit modules.

Develop balanced team with strong process expertise to execute with agility and deliver high quality, on-time solutions to meet internal and external customer needs.

Participate in internal and external customer/collaborator meetings, as needed, to provide feasibility assessments during project scoping and problem troubleshooting/solutions.

Actively participate with program leadership to devise near and medium-term process technology roadmaps to intercept future industry needs

Identify gaps in process and equipment capabilities and propose new process solutions to meet future challenges

Maintain good network with equipment/material vendors as well as internal/external collaborators, and lead acquisition of new materials/equipment capabilities through procurement or collaborations.

Job Requirements:

PhD with specialization in Electrical & Electronics Engineering / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.

At least 8 years of semiconductor industry experience in process engineering functions within a technology development organization, with solid exposure to atleast two or more process areas among electroplating, CMP, and wafer bonding. Exposure to assembly technologies including dicing and backgrinding is a plus.

At least 3 years of experience leading a team of engineers in a dynamic environment, with demonstrated skills in managing multiple internal and external stakeholders.

Strong foundational knowledge in advanced packaging/heterogeneous integration or silicon photonics would be a plus.

Strong interpersonal skills as well as demonstrated skills in collaborating with internal and external stakeholders is necessary.

At least 5 years of demonstrated experience in managing projects of moderate to high complexity involving cross-functional collaboration is desired.

Demonstrated ability to navigate multiple projects and stakeholders in a dynamic environment and ability to thrive in ambiguous situations with a “can-do” attitude is highly desired.

Good analytical/critical thinking skills and oral/written communication skills, with ability to deliver clear and concise messages to leadership teams and internal/external collaborators and customers.

Self-driven with strong interest in the future of semiconductor technologies, constantly keeping up with industry trends.