Senior Manager, PDE Central MRDA

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD
Singapore
USD 100,000 - 160,000
Job description

As a Senior Manager in PDE (Package Development & Engineering) at Micron, you will be responsible for the success within your scope and guided by functional objectives. You will be responsible for the overall management of Advanced and Conventional Packaging in your area of responsibility in terms of process, equipment and application definition, development and/or optimization. You will be forming and developing a high performing team and the development of current and future PDE & Micron leaders. You will be managing and optimizing departmental performance to meet or beat defined metrics. You will apply extensive knowledge to carry out strategies and collaborate with internal and external stakeholders to build and execute packaging technology strategies aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

KEY RESPONSIBILITIES and TASKS

Building an Effective Team Members and Managing Group Performance

  • Develop a high performing team
  • Establish department objectives aligned to company strategic objectives and goals.
  • Prioritize objectives, remove barriers, and drive for accountability.
  • Establish job responsibilities, performance goals and development goals for direct reports.
  • Provide performance feedback on an ongoing basis and conduct performance appraisal for direct reports. Collect, review, and provide verbal and written performance feedback to continuously develop your team.
  • Optimize department performance and structure. Monitor and oversee department performance achievement and provide timely intervention on initiatives that need help.
  • Coach, mentor and develop current and future Micron leaders. Assess talent and develop talent management strategies.
  • Support learning opportunities within department and plan development opportunities for direct reports.
  • Provide consultation or execute timely intervention to prevent or resolve conflicts with minimal noise.
  • Establish strategies to provide and support recognition.
  • Promote and oversee partnerships across functional areas and customer groups.
  • Use communication skills to resolve sensitive or difficult issues.

Drive and Provide Leadership to Achieve Functional Objectives and Vision

  • Provide organizational leadership to build functional strategies & processes, and collaborate with stakeholders to deliver strategic solutions.
  • Lead the setup and commissioning of the new manufacturing facility, ensuring it is equipped and optimized for Advance Packaging production.
  • Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
  • Develop and monitor department performance to plan. Develop and measure department metrics and oversee functional metrics to ensure deliverables are met.
  • Collaborate with peers to construct global solutions.
  • Ensure conflict resolution and assist with identifying escalation paths.
  • Align internal strategies and communicate line of sight to corporate strategic objectives.
  • Communicate the corporate business environment and initiatives and provide direction.
  • Establish and communicate department capabilities to ensure stakeholder expectations are aligned.
  • Manage conflict and build effective relationships with internal and external stakeholders.
  • Initiate and sustain effective communication with internal and external stakeholders.
  • Provide advice to senior and executive management on strategic decisions.
  • Establish and manage budget/finances for the team.
  • Develop quality & continually improve Advance Packaging process/equipment/materials.
  • Oversee the development and optimization of semiconductor packaging processes specific to Advance and conventional Packaging in your area of ownership, and collaborate with team members & stakeholders in other areas of HBM modules (Chemical/Plasma, Deposition, Stack & Bond, Wafer Prep, Thermal, Inspection) to ensure high yield and quality standards are met.
  • Perform process and tool capability assessment. Assess & validate CTQ (critical to quality).
  • Define and implement the necessary quality system and documentation, encompassing initial design to full-scale production.
  • Accountable for improving the yield, quality and reliability through proper process definition, characterization and optimization.
  • Work with cross functional team for a successful process/equipment/material development, CIP, and on other key strategic projects & programs implementation.
  • Manage the selection, installation, and maintenance of equipment necessary for Advance & Conventional Packaging. Collaborate with vendors and internal teams.
  • Identify risks and mitigation plans with stakeholders & alignment with cross functional teams.
  • Drive programs to satisfactory conclusion.
  • Identify, diagnose and resolve issues during NPI phase by applying problem solving skills.
  • Develop and manage budgets for facility operations, including forecasting, cost controls, and resource allocation.

New Product Introduction & Development of Process of Record (POR)

  • Evaluate new risks identified with new products and provide engineering solutions and train workforce, if necessary.
  • Monitor new product quality indices with PMI (process maturity index).
  • Work with engineering team on any issues/problems, potential risks & opportunities.
  • Define process variables, critical parameters, boundaries condition, process optimization via process characterization to establish & define POR/TOR/MOR.
  • Validate and document baseline for transferred products and packages.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
  • 8 or more years of experience in Semiconductor Manufacturing in a leadership capacity, with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA. Experience in Front End, PWF, HBM technology in process/equipment/development/product transfer is of greater advantage.
  • Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
  • Demonstrated ability to influence senior leaders and stakeholders on tactical decisions across multiple functions and geographies.
  • Ability to effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
  • Demonstrated ability to drive and execute a wide range of global initiatives with global teams.
  • Organized, detail-oriented, and strong focus on results.
  • Demonstrated ability to inspire teamwork and to effectively lead others.
  • Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
  • Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
  • Excellent analytical skills and organizational competency.
  • Good communication skills.
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