Senior Manager/ Manager, APTD, Post-Fabrication Wafer Finish (PWF)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Sr Manager/Manager for its Advanced Packaging Technology Development team. The successful candidate will oversee wafer finish engineering, driving the deployment of innovative packaging solutions while ensuring performance and quality. With a focus on collaboration and strategic leadership, you will help shape company objectives and mentor junior engineers, playing a vital role in advancing technology and achieving organizational goals.

Qualifications

• Strong understanding of semiconductor processes and equipment interactions.
• Ability to lead teams and manage multiple projects simultaneously.
• Exceptional communication skills to present at various organizational levels.

Responsibilities

• Lead post-fab wafer finish engineering for advanced packaging.
• Collaborate with internal/external partners to align strategies.
• Set fiscal year technical objectives aligned with department goals.
• Ensure accuracy, quality, and timeliness of results.

Skills

Semiconductor process engineering

Wafer bonding

Plating

Warpage control

Equipment development

Problem-solving

Project management

Communication skills

Education

B.S/M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics

Job description

We are looking for a Sr Manager/Manager to join our Advanced Packaging Technology Development (APTD) team!

You will lead the post-fab wafer finish (PWF) engineering to enable deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.

Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Other responsibilities include ensuring organizational compliance to company policies, departmental procedures, providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects.

Key responsibilities and duties include:

Develop and Communicate Advanced Packaging Technology Development Strategy

• Develop and communicate Advanced Packaging Technology Development strategic objectives

• Understand the impact and implications of APTD strategy to the overall company strategy and direction

Technical Leadership

• Set fiscal year technical objectives and insure they are aligned with department objectives

• Demonstrate understanding of technology complexity and effective technology decision making

• Provide technical leadership that may influence company direction

Multi-Functional Leadership

• Represent APTD in providing cross department leadership in area of responsibility

• Work effectively with peers in other department to develop and drive multi-functional initiatives

Impact and Execution

• Ensure accuracy, quality, and timeliness of results

• Guide best utilization of resources to achieve end results

• Ensure critical work, milestones and goals are met by the team

Growth Mindset

• Continue to build new skills through development goals and learning events.

• Seek out opportunities to work multi-functionally, build a network, and gain competency across domains

Training and Development:

• Conduct performance appraisals with team members to create goals and development plans

• Mentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technology

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields

• 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field, preferably in Technology Development

• Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

• Consistent track record to solve problems and address root causes

• Ability to multi-task and manage numerous projects simultaneously

• Tenacity to work effectively under timelines and limited resources

• Validated ability to lead small and large teams, directly or indirectly, toward common goals

• Outstanding communication and presentation skills, written and verbal to all levels of an organization