Senior Manager, HBM Customer Integration & System Engineering

Micron Technology

Singapore

On-site

SGD 240,000 - 360,000

Full time

9 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Micron Technology, a leader in memory and storage solutions, seeks a senior engineering leader to drive customer integration and system engineering across Asia and the United States. You will partner with design, product and manufacturing teams to translate customer needs into scalable product solutions, with a focus on HBM architecture and AI-enabled deployments.

This role requires 10+ years in semiconductor engineering or engineering leadership, excellent communication, and the ability to

Qualifications

  • BS/MS in Electrical Engineering, Computer Engineering, or related field.
  • 10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience.
  • Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification.
  • Proven ability to lead global cross-functional teams and influence executive-level stakeholders and customers.
  • Excellent communication, leadership, and problem-solving skills.

Responsibilities

  • Lead and develop teams responsible for customer integration, technical engagement, and system engineering.
  • Drive customer technical interlocks, design reviews, escalations, and integration activities.
  • Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.
  • Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement.
  • Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification.
  • Drive resolution of complex technical issues while influencing future product and technology roadmaps.
  • Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges.

Skills

Global cross-functional leadership
Executive stakeholder communication
Customer-facing leadership
HBM architecture knowledge
System integration

Education

BS/MS in Electrical Engineering, Computer Engineering, or related field

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Key Responsibilities
  • Lead and develop teams responsible for customer integration, technical engagement, and system engineering.
  • Drive customer technical interlocks, design reviews, escalations, and integration activities.
  • Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.
  • Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement.
  • Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification.
  • Drive resolution of complex technical issues while influencing future product and technology roadmaps.
  • Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges.
Qualifications
  • BS/MS in Electrical Engineering, Computer Engineering, or related field.
  • 10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience
  • Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification.
  • Proven ability to lead global cross-functional teams and influence executive-level stakeholders and customers.
  • Excellent communication, leadership, and problem-solving skills
Preferred Experience
  • Customer-facing leadership experience with hyperscale, AI, networking, or semiconductor customers.
  • Experience leading geographically distributed teams across Asia and the United States.
  • Knowledge of advanced memory solutions, AI systems, and high-performance computing platforms.
About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Manager, HBM Customer Integration & System Engineering
Senior Manager, HBM Customer Integration & System Engineering

1100 Micron SemiAsiaOP Pte Ltd • Singapore

On-site
SGD 180,000 - 240,000
Sr Manager, High Bandwidth Memory (HBM), Product Development Team Leader
Sr Manager, High Bandwidth Memory (HBM), Product Development Team Leader

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

On-site
SGD 180,000 - 240,000
Customer Integration Engineer (HBM)
Customer Integration Engineer (HBM)

1000 Micron Technology, Inc. • Singapore

On-site
SGD 90,000 - 140,000
Sr Manager, High Bandwidth Memory (HBM), Product Development Team Leader
Sr Manager, High Bandwidth Memory (HBM), Product Development Team Leader

Micron Technology • Singapore

On-site
SGD 180,000 - 260,000
None
Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)
Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)

Micron Technology • Singapore

On-site
SGD 90,000 - 130,000
Engineer - HIG HBM - PE Design Validation
Engineer - HIG HBM - PE Design Validation

Micron Technology • Singapore

On-site
SGD 47,000 - 80,000
Staff Engineer, Product Integration Lead, HIG High Bandwidth Memory
Staff Engineer, Product Integration Lead, HIG High Bandwidth Memory

1100 Micron SemiAsiaOP Pte Ltd • Singapore

On-site
SGD 120,000 - 180,000
Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

Micron Technology • Singapore

On-site
SGD 100,000 - 130,000
Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)

1100 Micron SemiAsiaOP Pte Ltd • Singapore

On-site
SGD 70,000 - 100,000
Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Staff Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Micron Technology • Singapore

On-site
SGD 120,000 - 180,000