Senior Engineer, WB Process Engineering

KULICKE & SOFFA PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A leading company in semiconductor and electronics assembly is seeking a Process Engineer to enhance their innovations in wedge bonding technology. This role involves technical consultations with customers, collaboration on new product developments, and supporting the research team, making it ideal for a dynamic engineer passionate about technology.

Qualifications

• 2 to 5 years of experience in manufacturing, engineering, or research development required.
• Experience with semiconductor packaging or hybrid microelectronics assembly is a plus.
• Willingness to travel locally and internationally up to 25% annually.

Responsibilities

• Lead application feasibility studies and collaborate with technical teams.
• Support R&D projects for wedge bond solutions and conduct technical tests.
• Provide pre-and post-sales technical support and prepare reports.

Skills

Effective verbal and written communication skills in English

Cross-functional collaboration

Problem-solving

Education

Bachelor's, Master's, or PhD in Materials Science, System Engineering, Electrical or Mechanical Engineering, or Physics

Tools

Six Sigma methodology

Minitab

JMP

Python programming

Job description

Are you passionate about innovation and eager to make a significant impact in the field of wedge bonding technology? We are looking for a talented Process Engineer to join our dynamic team. In this role, you will collaborate with other engineering functions, sales, and marketing teams to evaluate and demonstrate the feasibility of our products, support customer sample builds, and contribute to exciting research and development projects.

Overview:

The Process Engineer leads process-related application efforts for our customers’ new applications, new product developments, and field-sustaining issues.

• Customer engagement and application feasibility studies: Collaborate with Sales and Technical Solutions Managers on our customer application requests. Produce evaluation report on the application study.
• Assist with research and development projects to advance wedge bond interconnect solutions: Work closely with the development team to study new equipment capabilities and develop new processes. Serve as the local area expert and execute new product deployment in the field.
• Process troubleshooting and sustaining support: Analyze, troubleshoot, and resolve 2nd level escalated field support issues. Provide technical consultation to customers and internal teams on wedge bond processes.

Responsibilities:

• Work closely with sales and marketing to assess potential applications of our products through rapid prototyping and product demonstrations.
• Assist customers with sample build requests and support research and development projects to enhance wedge bond interconnect solutions.
• Participate in onsite and/ or offsite demo bonder qualifications, Alpha and Beta tests for potential customers.
• Plan and conduct tests to address process knowledge gaps and develop best-known methods for new and existing processes.
• Share product knowledge within the applications team during product development projects.
• Provide technical consultation to customers and internal teams on wedge bond processes and support sustaining issues.
• Offer pre-and post-sales technical support, working with customers from initial contact through delivery and installation.
• Prepare and present technical reports, concepts, data, and recommendations to management, customers and participate in technical seminars with the sales and marketing team.

Qualifications:

• Bachelor’s, Master’s, or PhD in Materials Science, System Engineering, Electrical or Mechanical Engineering, or Physics.
• Experience with Six Sigma methodology and statistical tools (Excel, Minitab, JMP) is a plus.
• 2 to 5 years of experience in manufacturing, engineering, or research development. Experience with semiconductor packaging or hybrid microelectronics assembly is a plus.
• Knowledge of Python programming and electro-mechanical systems is beneficial.
• Experience with the Design of Experiments (DOE), ultrasonic bonding, and clip-attach processes is a plus.
• Effective verbal and written communication skills in English
• Ability to work independently and cross-functional collaboration environment, with a positive attitude and open mindset, flexible to adapt to changes in tasks and work environment.
• Willingness to travel locally and internationally up to 25% annually for on-site technical support.

Company Overview

Founded in 1951, Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) specialize in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets.

Please refer to the website for more details: www.kns.com.

Equal Opportunity

Kulicke & Soffa recruits on the basis of merit (such as skills, experience or ability to perform the job), regardless of age, race, gender, religion, marital status and family responsibilities, or disability.