Senior Engineer - Thermo & Mechanical Analysis (Up $7500 + AWS + VB, Northeast)

RecruitFirst Pte. Ltd; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

A leading company in the semiconductor industry seeks a Mechanical Engineer to perform advanced IC package analysis and enhance modeling capabilities. The ideal candidate will hold a Master's or Degree in Mechanical Engineering and have solid experience in FEM, simulation software, and various mechanical tests. This role offers a competitive salary package and a chance to work on innovative R&D efforts.

Qualifications

• Solid knowledge of FEM & mechanics of material.
• Mechanical and reliability test experience including drop tests.
• Keen for R&D activities in IC packaging technology.

Responsibilities

• Perform mechanical & thermo-mechanical analysis and characterization of advanced IC packages.
• Design advanced packages per reliability and manufacturability specifications.
• Conduct IC packaging technology development with teams.

Skills

Mechanical modeling

Thermo-mechanical modeling

FEM

Thermal Modeling

Education

Degree or Master in Mechanical Engineering

Tools

Ansys

Abaqus

Flotherm

Icepak

Job description

Up to $7500 + AWS + VB

Semiconductor Giant

North-East SG

Job Descriptions

• Perform mechanical & thermo-mechanical analysis and characterization of advanced IC packages

• Build up new mechanical & thermo-mechanical capabilities with latest simulation and characterization technologies

• Design advanced packages for customers to meet their reliability and manufacturability specifications & needs

• Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance

• Conduct IC packaging technology development together with other teams

• Carry out mechanical and reliability test and correlate with mechanical & thermo-mechanical simulation for validation

Requirements

• Degree / Master in Mechanical Engineering or related field

• Solid knowledge on FEM & mechanics of material

• Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqusis a must

• Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable

• Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable

• Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable

• Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis/ design/ optimization/ characterization

*To apply, send your CV/Resume to josephyap[at]recruitfirst.com.sg with reason(s) for leaving past employments, last drawn and expected salary.

All applications will be treated with strictest confidentiality. We regret that only shortlisted candidates will be notified. Thank you.

RecruitFirst Pte Ltd E.A. 13C6342

Joseph Yap Shi Hao (R1767577)