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A leading semiconductor manufacturer in Singapore is seeking an experienced engineer to develop molding and jig singulation processes. This role requires at least 5 years of experience in molding and jig singulation, and expertise in root cause analysis. You will be responsible for coordinating engineering builds, conducting failure analyses, and implementing process improvements. The candidate must have a Degree or Master in Engineering or a related field.
Up to $8000 + AWS + VB
Semiconductor Giant
North-East SG
Job Descriptions
• Molding and Jig Singulation Process Development
• Development of Molding process for iBGA new packages like iBGAm (iBGA mold version) and iBGApm (Pre-mold substrate iBGA).
• Expertise in root cause analysis and problem solving.
• Process / machine improvement and implementation of Molding and Jig Singulation machine/ process.
• Process Customer engineering builds with buy-off and data collections.
• Failure analysis and root cause investigation, report preparation & presentation
• Coordinate all customers’ engineering builds and qualification builds with relevant factory teams to maximize our resources.
• Set & monitor the KPI for the team base on Molding and Jig Singulation process development projects.
Requirements
• Degree / Master in Engineering or related field
• At least 5 years of experience in Molding Process and Jig Singulation Process
*To apply, send your CV/Resume to josephyap[at]recruitfirst.com.sg with reason(s) for leaving past employments, last drawn and expected salary.
All applications will be treated with strictest confidentiality. We regret that only shortlisted candidates will be notified. Thank you.
RecruitFirst Pte Ltd E.A. 13C6342
Joseph Yap Shi Hao (R1767577)