Senior / Engineer (Molding Process and Jig Singulation Process)

UTAC HEADQUARTERS PTE. LTD.; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

A leading company in electronics manufacturing seeks a Mold Engineer to develop and optimize processes for iBGA packages. The role involves extensive collaboration with engineering teams and demands significant expertise in high-volume production environments. Candidates should possess a relevant engineering degree and a minimum of five years' experience in similar roles, particularly in molding and jig singulation processes.

Qualifications

• 5 years experience as Mold Engineer.
• Knowledge of Jig Singulation process.
• Experience in high volume electronics manufacturing.

Responsibilities

• Develop Molding process for new iBGA packages.
• Perform failure analysis and generate reports.
• Coordinate customers' engineering builds with factory teams.

Skills

Root cause analysis

Problem solving

Process improvement

Optimization

Education

Bachelor Degree in Material Science, Mechanical Engineering, Electrical and/or Electronic

Job description

Responsibilities;

• Development of Molding process for iBGA new packages like iBGAm (iBGA mold version) and iBGApm (Pre-mold substrate iBGA).
• Expertise in root cause analysis and problem solving.
• Process / machine improvement and implementation of Molding and Jig Singulation machine/ process.
• Process Customer engineering builds with buy-off and data collections.
• Able to generate optimization plan, perform the optimization/DOE activities, generate report and presentation.
• Failure analysis and root cause investigation, report preparation & presentation
• Work with third party and identify solutions to enhance capabilities.
• Coordinate all customers’ engineering builds and qualification builds with relevant factory teams to maximize our resources.
• Monitor & track the progress of key deliverables to achieve defined Key Milestone and Success Criteria including regular communication with customers
• Set & monitor the KPI for the team base on Molding and Jig Singulation process development projects.

Requirements;

• Bachelor Degree in Material Science, Mechanical Engineering, Electrical and/or Electronic or any related engineering discipline
• Experience in high volume electronics manufacturing environment preferably in image sensor BGA , semiconductor and/or camera module assembly.
• OSAT experience will be an advantage.
• At least min 5 years working experience as Mold Engineer and with Jig Singulation process knowledge.