Senior Engineer - (Mechanical & Thermal Analysis)

UTAC; Singapore; On-site; SGD 100,000 - 125,000; Full time

Job summary

An established industry player is seeking a Senior Engineer specializing in Mechanical and Thermal Analysis. In this pivotal role, you will perform in-depth mechanical and thermal analysis of advanced IC packages, employing the latest simulation and characterization technologies. Your expertise will help design innovative packaging solutions that meet stringent reliability and manufacturability standards. Collaborating with cross-functional teams, you will assess new packaging technologies and conduct essential testing to validate performance. If you are passionate about R&D in IC packaging technology and thrive in a dynamic environment, this opportunity is perfect for you.

Qualifications

• Degree or Master in Mechanical Engineering or related field required.
• Solid knowledge of FEM and mechanics of materials essential.

Responsibilities

• Perform mechanical and thermal analysis of advanced IC packages.
• Design advanced packages to meet reliability and manufacturability specifications.

Skills

FEM

mechanics of material

mechanical modeling

reliability testing

thermal modeling

interpersonal skills

communication skills

Education

Degree in Mechanical Engineering

Master in Mechanical Engineering

Tools

Ansys

Abaqus

Flotherm

Icepak

Job description

Senior Engineer - (Mechanical & Thermal Analysis)

22 Ang Mo Kio Ind Park 2, Singapore 569506 Req #463

Please join us!

Responsibilities:

• Perform mechanical & thermal analysis and characterization of advanced IC packages
• Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
• Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
• Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
• Conduct IC packaging technology development together with other teams
• Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation

Requirements:

• Degree / Master in Mechanical Engineering or related field
• Solid knowledge on FEM & mechanics of material
• Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
• Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
• Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
• Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable
• Team player with good interpersonal and communication skills
• Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis/ design/ optimization/ characterization