Senior Engineer - (Mechanical & Thermal Analysis)

United Test And Assembly Center Limited (UTAC); Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A leading company in IC packaging is seeking a Mechanical Engineer to perform analyses and design tasks. You will work on advanced thermal and mechanical simulations to meet reliability specifications. This role requires solid educational background and hands-on experience in IC packaging technologies along with effective teamwork skills.

Qualifications

• Degree or Master in Mechanical Engineering required.
• Solid knowledge in FEM & mechanics of materials is essential.
• Mechanical modeling experience for IC packaging is must.

Responsibilities

• Perform mechanical & thermal analysis of IC packages.
• Design advanced packages to meet reliability specifications.
• Conduct IC packaging technology development with teams.

Skills

Mechanical modeling

Thermo-mechanical modeling

Team player

Interpersonal skills

Communication skills

Education

Degree / Master in Mechanical Engineering

Tools

Ansys

Abaqus

CFD software (Flotherm / Icepak)

Job description

Roles & Responsibilities

• Perform mechanical & thermal analysis and characterization of advanced IC packages
• Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
• Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
• Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
• Conduct IC packaging technology development together with other teams
• Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation

Requirements

• Degree / Master in Mechanical Engineering or relatedfield
• Solid knowledge on FEM & mechanics of material
• Mechanical modeling experience for IC package's stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqusis a must
• Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
• Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
• Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable
• Team player with good interpersonal and communication skills
• Keen for R&D activities in IC packaging technology development, package's mechanical & thermal analysis/ design/ optimization/ characterization