Senior / Engineer (Mechanical and Thermal Analysis)

Roles & Responsibilities

• Perform mechanical & thermal analysis and characterization of advanced IC packages
• Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
• Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
• Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
• Conduct IC packaging technology development together with other teams
• Carry out mechanical, thermal and reliability tests and correlate with mechanical & thermal simulation for validation

Requirements

• Degree / Master in Mechanical Engineering or related field
• Solid knowledge on FEM & mechanics of materials
• Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
• Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
• Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
• Thermal modeling experience using CFD software such as Flotherm / Icepak is highly desirable
• Team player with good interpersonal and communication skills
• Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis, design, optimization, and characterization