Senior Engineer - Bond/Grind/Trim Process Dev

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

A leading company in semiconductor technology is seeking a Process Development Engineer to enhance process margins and support technology deployment initiatives. This role involves collaboration with global teams, driving innovations in Bonding/Grind/Trim processes for advanced 3D NAND technologies. The ideal candidate will possess a strong educational background in materials science or engineering, coupled with hands-on experience in sophisticated equipment.

Qualifications

• Minimum 2 years hands-on experience.
• In-depth understanding of Bonding/Grind/Trim processes.
• Ability to work in demanding, dynamic environments.

Responsibilities

• Ownership of Bonding/Grind/Trim process characterization.
• Develop processes for next-generation 3D NAND nodes.
• Manage and initiate experiments for process margin improvements.

Skills

Collaboration

Communication

Data Analysis

Self-motivated

Adaptability

Education

Bachelor's degree in Materials Science, Chemical Engineering, or Physics

Tools

Bonding/Grind/Trim equipment

Optical metrology

Profilometry

Y3 data analysis system

Design of Experiments (DoE)

Job description

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3D NAND nodes.
• Transfer Bonding/Grind/Trim processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address process issues working with Fab10 team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND Bonding/Grind/Trim process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions.
• Identify process simplification opportunities and drive cross functional teams in implementation.
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors’ degree or higher in Materials Science, Chemical Engineering or Physics with minimum 2 years hands-on experience in leading edge Bonding/Grind/Trim equipment.
• Familiarity with Bonding/Grind/Trim equipment operation, optical metrology and profilometry
• In-depth understanding of Bonding/Grind/Trim process mechanisms
• Understanding of various integration and structural impacts and constraints related to Bonding/Grind/Trim process.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects.
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously.
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.
• Suitable candidates may be considered for Expat posting to Singapore from overseas locations.

• GJS for this position: E3 and above
• Hiring Manager: HE JIAN
• Location: Fab10, 1 North Coast Drive, Singapore
• Closing Date: 31/07/2025