THE COMPANY
Our Client is in the semiconductor industry with a strong presence in APAC and Singapore. They are looking for a Senior Engineer, Back-end Equipment to join their team in Singapore, reporting to the Head of Department.
THE ROLE
The Senior Engineer, Back-end Equipment is responsible for:
Lead process development and enhancements to boost yield, reduce cost, and improve manufacturing efficiency.
Manage equipment selection, setup, and validation, ensuring smooth integration into production lines.
Use statistical tools like SPC, DOE, and Six Sigma to analyze data and identify process improvements.
Provide expert technical support for both equipment and process issues, working closely with other teams to troubleshoot and improve systems.
Collaborate with cross-functional departments to drive innovation and efficiency in back-end manufacturing processes.
Requirements:
At least 8 years of experience with semiconductor equipment used in packaging, assembly, and testing.
Strong hands-on experience with die sorters, flip-chip bonding, and die bonding equipment.
Skilled in solving technical problems and optimizing processes using advanced manufacturing tools.
Proficient in using statistical software like JMP or Minitab, with good knowledge of ISO and JEDEC standards.
Certified in Six Sigma or Lean Manufacturing methodologies.
Excellent problem-solving and communication skills, with the ability to work both independently and collaboratively, and willingness to travel occasionally for customer or site visits.