Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization ([...]

Micron Technology, Inc; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A global memory solutions leader is seeking a Post-Fab Wafer Finish Engineer to develop processes related to semiconductor manufacturing in Singapore. The ideal candidate will have a strong background in semiconductor process development, exhibit exceptional problem-solving skills, and be capable of collaborating with various internal teams to enhance manufacturing processes. This role offers a full-time position within an innovative team.

Qualifications

• 2 or more years of experience in semiconductor process development.
• Strong understanding of the interactions in process flows.
• Experience under tight deadlines and limited resources.

Responsibilities

• Develop and enable deployment processes related to wafer finishing.
• Evaluate and promote new equipment and materials.
• Conduct continuous data analysis for quality improvement.

Skills

Semiconductor process development

Design of experiments techniques (DOE)

Statistical Process Control (SPC)

Defect analysis

Problem-solving

Education

B.S/M.S./Ph.D. in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related fields

Job description

Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loaded

Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding

Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for a Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Key responsibilities and duties include:

Process Development:

• Establish and improve PWF process conditions and technologies (wafer thinning, backside metal interconnect)

• Upgrade process capabilities and reduce production costs

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.

Equipment and Materials:

• Evaluate and promote new equipment and materials to enhance process capabilities

• Set up process parameters for a variety of semiconductor equipment

• Evaluate, promote, and plan for new equipment and materials

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development, qualification, small volume production to high volume production

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

Requirements:

• B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields

• 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis

• Tenacity to work effectively under timelines and limited resources

• Consistent track record to solve problems and address root causes

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Similar Jobs (20)

Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

locations Fab 10A, Singapore time type Full time posted on Posted Yesterday

Engineer - HIG HBM - PE Design Validation

locations Fab 10A, Singapore time type Full time posted on Posted 8 Days Ago

Senior/Engineer, Advanced Packaging Integration - Package Design/ Layout

locations Fab 10A, Singapore time type Full time posted on Posted Yesterday