Semiconductor Tech Engagement Lead

KLA-Tencor (Singapore) Pte Ltd

Singapore

On-site

SGD 120,000 - 180,000

Full time

3 days ago
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Job summary

KLA-Tencor (Singapore) Pte Ltd is seeking a dynamic engineering manager to lead a team delivering technical applications support for our semiconductor inspection solutions at customer wafer fabrication and packaging facilities.

You will collaborate with the Head of Product Marketing, Sales, and Applications leaders to shape strategies, influence next‑generation product features, present to management and customers, and help translate requirements into concrete product specifications.

Qualifications

  • Master's or Bachelor's degree in Engineering, Physics, or Materials Science.
  • Strong communication, organizational, analytical, leadership, and interpersonal skills.
  • Self-driven, team player capable of thriving in a dynamic environment.
  • Experience in Semiconductor Wafer Packaging is advantageous.
  • Managerial or supervisory experience is a plus.

Responsibilities

  • Lead a team of engineers to provide technical applications support for development and implementation of KLA's state-of-the-art products at customer wafer fabrication and packaging facilities.
  • Collaborate with Head of Product Marketing, HQ Product Marketing Manager, Sales, and Head of Applications to develop strategies aligning with customer needs and shaping next-generation features.
  • Present on product aspects to KLA management and customer management; assist Sales in applying products to meet technical requirements.
  • Investigate yield issues and provide inspection solutions; handle complex problems requiring in-depth evaluation and cross-functional communication.

Skills

Leadership
Communication
Analytical
Interpersonal
Team Collaboration

Education

Engineering degree
Physics degree
Materials Science degree

Job description

KLA-Tencor (Singapore) Pte Ltd is seeking a dynamic engineering manager to lead a team delivering technical applications support for our semiconductor inspection solutions at customer wafer fabrication and packaging facilities.

You will collaborate with the Head of Product Marketing, Sales, and Applications leaders to shape strategies, influence next‑generation product features, present to management and customers, and help translate requirements into concrete product specifications.

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