Semiconductor Process Engineer (Laser Bonding) - 8890

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading HR advisory firm in Singapore seeks a Laser-Assisted Bonder process engineer. You will develop and optimize laser bonding processes for advanced packaging applications, requiring 2–5 years of experience and familiarity with bonding technologies. The role offers competitive salary and opportunities for continuous improvement and cross-functional collaboration.

Qualifications

• Minimum 2–5 years of hands-on experience in the semiconductor packaging.
• Experience with Laser Assisted bonding is highly preferred.
• Familiarity with bonding equipment and analytical tools.

Responsibilities

• Develop laser-assisted bonding processes for product packaging.
• Qualify new processes from R&D to production.
• Troubleshoot bonding processes and resolve quality issues.

Skills

Laser-Assisted bonding technologies

Troubleshooting and problem-solving

Statistical analysis (JMP, Minitab)

Risk analysis and FMEA

Knowledge of bonding processes

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Tools

X-ray

SAM

OM

Job description

Position title : Laser-Assisted Bonder (LAB) process engineer / Semiconductor Process Engineer (Laser Bonding)

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirments

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Familiarity with advanced process control and manufacturing best practices
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested Personal kindly contact WhatsApp :[phone](Lydia)

OR

Email to : [e-mail]

The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279