Semicon Mold Process Engineer

People Profilers; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading staffing agency is seeking a candidate to enhance assembly processes in the semiconductor field. The ideal applicant should have at least 2 years of experience in semiconductor assembly packaging, specifically in process development. Strong knowledge of problem-solving tools is essential. This position requires the ability to work on 12-hour shifts if necessary, with a competitive remuneration package offered.

Benefits

Competitive remuneration package

Comprehensive range of benefits

Qualifications

• Minimum 2 years in semiconductor assembly packaging experience.
• Experience in process development or process sustaining.
• Experience with Flip Chip Molding and Singulation Punch preferred.

Responsibilities

• Improve assembly processes and capabilities for quality and productivity.
• Ensure products meet customer requirements on quantity and cycle time.
• Provide corrective actions for discrepancies through troubleshooting.

Skills

Semiconductor assembly packaging experience

Basic Problem Solving Tools

FMEA

Statistics (SPC)

DOE (SAS Jmp)

8D report

QC Tools

Failure Analysis

Job description

• To continuously improve Assembly processes and assembly capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and controlled operating procedures.
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers requirements in terms of quantity, yield and cycle time.
• To provide interim and long-term corrective actions for any discrepancies through troubleshooting, parameter optimization and execution of defined process improvements.
• Liaise with internal (Manufacturing, Equipment, QA) and external customers on smooth transition and implementation of defined process activities and improvements.
• Prepare reports and documentations with respect to process, materials, customers, & other specification as required.
• Perform cost reduction and cycle time improvement projects from conceptualization, planning, execution and implementation within specific time frame.

Requirement:

Minimum 2 years semiconductor assembly packaging experience in process development or process sustaining. Flip Chip Molding (Vacuum Mold), Singulation Punch and Saw process experience preferred.

Knowledgeable and application of Basic Problem Solving Tools and systems such as FMEA, Statistics (SPC), DOE (SAS Jmp), 8D report, QC Tools and others.

Know-how in Failure Analysis and Reliability activities is an added advantage.

Ability to work on 12-hour rotating shifts if required

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

We regret that only shortlisted candidates will be notified

People Profilers Pte Ltd