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Hewlett Packard Co. in Singapore is seeking a College Intern – R&D Mechanical Engineer to support printer product development. The role involves documenting design rules and using CAD to create mechanical parts, with AI/ChatGPT tools aiding engineering problem analysis.
The internship runs about 5–6 months starting around May 2027, with full-time schedule and no shift premium. Candidates pursuing a Mechanical Engineering degree with hands-on project passion are encouraged to apply.
Hewlett Packard Co. in Singapore is seeking a College Intern – R&D Mechanical Engineer to support printer product development. The role involves documenting design rules and using CAD to create mechanical parts, with AI/ChatGPT tools aiding engineering problem analysis.
The internship runs about 5–6 months starting around May 2027, with full-time schedule and no shift premium. Candidates pursuing a Mechanical Engineering degree with hands-on project passion are encouraged to apply.