R&D Mechanical Engineer Intern – CAD & AI Prototyping

Hewlett Packard Co.

Singapore

On-site

SGD 13,000 - 27,000

Full time

5 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Hewlett Packard Co. in Singapore is seeking a College Intern – R&D Mechanical Engineer to support printer product development. The role involves documenting design rules and using CAD to create mechanical parts, with AI/ChatGPT tools aiding engineering problem analysis.

The internship runs about 5–6 months starting around May 2027, with full-time schedule and no shift premium. Candidates pursuing a Mechanical Engineering degree with hands-on project passion are encouraged to apply.

Qualifications

  • Pursuing a degree in Mechanical Engineering with internship eligibility.
  • Strong analytical thinking and problem solving.
  • Fundamental knowledge of mechanical product design.
  • CAD drawing and mechanical design exposure.
  • Interest in AI/ChatGPT applications to support engineering.

Responsibilities

  • Works with R&D team on printer product development.
  • Documents design rules on various areas of product design.
  • Uses CAD software to design mechanical parts for printer product.
  • Uses simulation and AI software to understand design robustness.
  • Goes through the design process from design intent to actual prototype.
  • Establishes optimized machine setting and test specification for maximum yield with reduced cycle time.
  • Develops loss function with statistical test to validate test specification to filter defects.

Skills

Analytical thinking
Project management
Problem solving
Hands-on mindset

Education

Degree in Mechanical Engineering (in progress)

Tools

CAD Software

Job description

Hewlett Packard Co. in Singapore is seeking a College Intern – R&D Mechanical Engineer to support printer product development. The role involves documenting design rules and using CAD to create mechanical parts, with AI/ChatGPT tools aiding engineering problem analysis.

The internship runs about 5–6 months starting around May 2027, with full-time schedule and no shift premium. Candidates pursuing a Mechanical Engineering degree with hands-on project passion are encouraged to apply.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

R&D Mechanical Engineer Intern — CAD, AI & Prototyping
R&D Mechanical Engineer Intern — CAD, AI & Prototyping

HP • Singapore

On-site
SGD 13,000 - 22,000
College Intern – R&D Mechanical Engineer
College Intern – R&D Mechanical Engineer

HP • Singapore

On-site
SGD 13,000 - 22,000
College Intern – R&D Mechanical Engineer
College Intern – R&D Mechanical Engineer

Hewlett Packard Co. • Singapore

On-site
SGD 13,000 - 27,000
Electrical Hardware Intern (R&D) – Design & Test
Electrical Hardware Intern (R&D) – Design & Test

Hewlett Packard Co. • Singapore

On-site
SGD 11,000 - 22,000
Hardware Test Automation & AI Engineer Intern
Hardware Test Automation & AI Engineer Intern

Hewlett Packard Co. • Singapore

On-site
SGD 17,000 - 29,000
Intern: Process & Digitalization + AI in Manufacturing
Intern: Process & Digitalization + AI in Manufacturing

Hewlett Packard Co. • Singapore

On-site
SGD 20,000 - 27,000
College Intern: Agentic AI Hardware & Prototyping
College Intern: Agentic AI Hardware & Prototyping

Hewlett Packard Co. • Singapore

On-site
SGD 13,000 - 20,000
NPI Writing Systems Engineer Intern
NPI Writing Systems Engineer Intern

Hewlett Packard Co. • Singapore

On-site
SGD 17,000 - 23,000
NPI Writing Systems Engineer Intern | Test & Automation
NPI Writing Systems Engineer Intern | Test & Automation

HP • Singapore

On-site
SGD 17,000 - 23,000
College Intern — AI-Driven Hardware Test Automation
College Intern — AI-Driven Hardware Test Automation

HP • Singapore

On-site
SGD 20,000 - 27,000