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An innovative firm is seeking an R&D Manager to spearhead the development of advanced PCB technologies and materials. This role involves researching new materials, optimizing high-speed PCBs, and collaborating with fabrication and testing teams to ensure quality and efficiency. The ideal candidate will have a solid educational background in engineering and relevant experience in PCB design and R&D. Join a forward-thinking company where your contributions will drive technological advancements and enhance product performance in a dynamic industry.
Company and Job Overview
Our client is a leading PCB manufacturer. We are looking for an R&D Manager to develop advanced PCB technologies, materials, and processes to enhance product performance, reliability, and manufacturability.
Responsibilities
Research and develop new PCB materials, stack-ups, and manufacturing processes to improve performance, cost efficiency, and reliability.
Design and optimize high-speed, high-frequency, HDI (High-Density Interconnect), and rigid-flex PCBsfor various applications.
Conduct feasibility studies, simulations (signal integrity, thermal, EMI/EMC), andprototyping to validate new designs and technologies.
Collaborate with PCB fabrication, assembly, and testing teamsto ensure manufacturability and quality standards.
Stay updated with industry trends, emerging technologies (e.g., embedded components, advanced substrates), and IPC standards.
Troubleshoot and resolve technical challenges related to PCB design, fabrication, and assembly.
Work with customers and suppliers to define technical requirements and develop customized solutions.
Document R&D findings, prepare technical reports, and present recommendations to stakeholders.
Support patent applications and intellectual property development for innovative PCB technologies.
Qualifications & Experience:
Education: Bachelor’s/Master’s degree inElectrical/Electronics Engineering, Chemistry/Chemical engineering, Materials Science,Mechanical Engineering, or related field.
Preferably 1-3 years in management of PCB design, fabrication, or R&D (experience with high-frequency/RF, High speed PCBs is a plus).
Knowledge of IPC standards, DFM (Design for Manufacturability), and signal integrity analysis and familiarity with high laminate such as low loss dielectrics is a strongplus
Familiarity with AI/ML applications in PCB design
Experience with thermal management, EMI shielding, or embedded passive/active components.
Knowledge of additive manufacturing (3D printing) for PCBs
Catherine Qu
JAC Recruitment Pte Ltd
EA Personnel: R22104823
EA Personnel Name: QU QIUSHI
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