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Product Specialist (Process & Equipment) | Semicon

Manpower Staffing Services (S) Pte Ltd - Head Office

Singapore

On-site

SGD 60,000 - 80,000

Full time

16 days ago

Job summary

A leading company in Singapore is seeking a Product and Technical Development Support professional. The role involves providing technical expertise and support for thermal compression products, ensuring strong collaboration with sales and R&D teams, and enhancing product processes. Candidates should possess a degree in relevant engineering fields and extensive technical experience, including product support in a complex environment.

Qualifications

  • Minimum 5 years experience in a complex Technical environment.
  • 3 years in Product Support environment & RnD support.
  • Hands-on experience in semiconductor front end or backend Process.

Responsibilities

  • Provides support for Thermal Compression product setup & demo.
  • Engages in R&D projects during product definition / requirement engineering.
  • Conducts training to FSE's and Customers.

Skills

Good PC skills
MS-Office
AutoCAD knowledge
Statistical data analysis

Education

Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering

Job description


Product and Technical development Support

  • Provides support for Thermal Compression (TC) product setup & demo
  • Conducts feasibility studies, sample bonding and generate report
  • Builds-up good technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team
  • Defines DOE's and experimental process trials & collects Process Data
  • Scouts and reports new product ideas and innovation with the goal to enhance the product related to thermal compression bonding
  • Understands the Thermal compression bonding process from Physics/Chemistry point of view and relate to actual bonding
  • Acquires knowledge on pre and post die bonding processes
  • Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve process or provide solutions to problems
  • Engages in R&D projects during product definition / requirement engineering, SW test and customer product testing
  • Understands the different process for thermal compression bonding (C2S, C2W, Flux or Fluxless)
  • Deep dive and troubleshoot process related or equipment related to issues and suggest improvements in HW design/SW logic
  • Defines SW requirements for new modules and features/Process sequence and Data/information exchange with different stakeholders.
  • Collects process / production / competitor data at customer site
  • Supports SOP, technical documentation and product operating manual writing activities and publish BKM

Pre- & After Sales Support

  • Conducts evaluations, demos and generate test report and instructions
  • Support Sales and CPMs during Pre-Sales and demo activities
  • Establishes good customer relationship on technical level with key accounts assigned
  • Provides Technical Info to CPMs/Sales and/or product group.

Technical Support, 2nd Level support

  • Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer
  • Investigates issues at customer site and supports Engineering team for fast and short time to solution
  • Provide application support for internal & external customers
  • Conducts training to FSE's and Customers

Requirements
Education

  • Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering

Work experience

  • Minimum 5 years of experience in a complex Technical environment and 3 years in Product Support environment & RnD support
  • Experience in production environment on Die attach/die bonding know how can be an asset
  • Hands-on experience in semiconductor front end or backend Process and equipment

Expertise and methodology

  • Good PC, MS-Office, AutoCad knowledge
  • Matlab, JMP and statistical data analysis skills desirable
  • Excellent wafer fab Front end/Backend Metrology knowledge

Goel Navneet License No.: 02C3423 Personnel Registration No.: R1982194

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