Job Summary
Join a dynamic semiconductor organization and play a key role in driving product quality, equipment integration, and new product introduction initiatives.
Responsibilities
- Lead quality assurance activities for semiconductor manufacturing equipment, modules, and incoming components, including qualification, reliability testing, failure analysis, and yield improvement.
- Support semiconductor equipment and machine integration projects, ensuring smooth process integration and compliance with quality standards.
- Drive quality activities throughout new product development and new product introduction phases, from design validation to production ramp-up.
- Collaborate with cross-functional teams to establish, monitor, and improve quality metrics, including SPC, defect reduction, and KPI achievement.
- Conduct root cause investigations, implement corrective and preventive actions, and support customer complaint resolution and field return analysis.
- Partner with Field Service Engineers to evaluate machine performance and implement continuous improvement initiatives.
- Mentor junior engineers and contribute to process and quality improvement projects across departments.
- Travel to manufacturing sites, suppliers, and customer locations to support audits, integration activities, and technical troubleshooting as required.
Requirements
- Degree in Engineering or a related discipline.
- Minimum 2 to 3 years of experience in Quality Engineering within the semiconductor industry, with exposure to NPI and NPD environments.
- Strong knowledge of quality methodologies, including Statistical Process Control (SPC), 8D problem-solving techniques, and Six Sigma practices.
- Experience in semiconductor equipment or machine integration, including process tool qualification and integration into manufacturing or fabrication environments.
- Hands-on experience in NPI/NPD activities, including product characterization, critical parameter identification, qualification testing, measurement system analysis (MSA), and production transfer processes.
- Experience developing and maintaining work instructions, standard operating procedures (SOPs), and inspection procedures.
- Strong analytical and problem-solving skills with proficiency in data analysis tools such as JMP and Minitab.
- Knowledge of reliability testing, failure analysis, and yield improvement methodologies.
- Ability and willingness to travel domestically and internationally as required.
- Experience in die bonder operation within high-volume manufacturing environments is an added advantage.
- Certification in quality methodologies such as Six Sigma or APQP is an added advantage.
- Experience in supplier or subcontractor quality management is an added advantage.
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