Process Technician (PVD/Evap Thin Film)

TECNISCO ADVANCED MATERIALS PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

TECNISCO ADVANCED MATERIALS PTE. LTD. is seeking a Process Engineer to contribute to Front/Back End process development for thermal management products. The role involves optimizing process parameters for cleaning, laser marking, dicing, mask design, and thin film deposition (PVD/evap).

You will collaborate with cross-functional teams, vendors and partners from concept prototyping to production introduction, ensuring robust process control and quality.

Qualifications

• 3+ years leading manufacturing processes in semiconductor front or back end (wafer bumping, dicing, mask design, plating).
• Knowledge of UHV vacuum equipment, sensors and components (pumps, valves, sensors, spectrometers, MFCs).
• Hands-on fabrication: mechanical assembly, design and manufacturing, mask design experience.
• Experience with CTQ metrics, RCA and yield improvement.
• Understanding of materials characterization and failure analysis techniques.
• Good communication and teamwork skills.

Responsibilities

• Support conductive metal film processes via Plating, PVD Sputtering and Vacuum Evaporation.
• Characterize films for metrology and inspection.
• Operate deposition tools, monitor processes, perform PM qualification, troubleshoot.
• Collaborate with integration and test teams to define CTQ metrics and drive root cause analysis.
• Work with equipment engineers and external suppliers on tool improvements.

Skills

Statistical analysis

Communication

Teamwork

Education

Engineer/Technician in Materials/Production Engineering

Tools

PVD Sputtering

Vacuum Evaporation

Mask design

Job description

Job Description & Requirements

As part of the Process Engineering group, this position involves contributing to the development of Front/Back End processes for thermal management product. The role also involves establishing and optimizing related process parameters related to process cleaning, laser marking, dicing, mask design, plating/sputtering PVD/Evap thin films. Also work closely with internal cross-functional teams, external vendors and technology partners on application development from concept prototype phase to production introduction.

Roles & Responsibilities

• Support processes for conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.


• Support film characterization techniques for metrology and inspection


• Perform day-to-day operations of deposition tools - tool and process monitoring, post PM process qualification, troubleshooting


• Work closely with integration and test teams on developing critical to quality (CTQ) metrics, root cause analysis (RCA) and corrective actions for yield improvements


• Work closely with equipment engineers and external suppliers on tool improvements and selection of new equipment

Requirements

• ITE Polytechnic/Diploma/Degree in Materials/Production Engineering or related field


• Min. 3 years of experience leading manufacturing processes in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.


• Knowledge of UHV vacuum manufacturing equipment and associated sensors and components (Pumps, valves, pressure sensors, spectrometers, MFC's, pressure controllers, pyrometers, etc.)


• Hands on fabrication: mechanical assembly, mechanical design and manufacturing and mask design.


• Experience working around delicate high-tech equipment.


• Experience in statistical analysis methods and tools, design of experiment


• Understanding of materials characterization and FA techniques


• Good communication and teamwork skills.