Process Integration Manager

people profilers pte. ltd.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

people profilers pte. ltd. is seeking a wafer process engineer to collaborate with AOI, process, and equipment teams to address defect density, excursions, and root cause solutions ensuring customer quality.

The role involves reviewing unresolved complaints, planning actions, and driving yield-focused improvements using DOE/SPC and systematic problem-solving methods. Responsibilities include leading process control updates, customer audits, and supporting new process/product qualification from

Qualifications

• Degree in Physics, Chemistry, Materials Science, Mechanical/Chemical/Electrical Engineering or equivalent.
• 5 to 10 years of relevant experience in wafer bumping, wafer fabrication or packaging.
• Strong knowledge in process integration scheme/ process stability and yield enhancement activities.

Responsibilities

• Work closely with AOI/process/equipment engineering team to swiftly contain high Defect Density and inline excursions and find root causes and provide working solutions to satisfy customer quality.
• Review unresolved requests for adjustment of complaints and read customer comments to determine basis of complaint and plan of action needed to resolve complaint.
• Drive process improvement plan based on systematic analysis of inline/Electrical Test/yield data to meet quality and yield targets.
• Identify key process weaknesses and perform fine tuning on existing processes for continuous improvement to yield/quality/productivity and cost.
• Use statistical knowledge (e.g. DOE, SPC) and systematic problem-solving techniques(e.g. 8D, 5 Whys) to determine root causes for low yield wafers/lots as well as developing containment/corrective/preventive action plans.
• Lead process control plan update and customer audit.
• Supportnew Process/Product qualification from product design through to LVM completion.

Skills

Problem solving

Statistical analysis

Root cause analysis

Team collaboration

Education

Engineering degree

Job description

Responsibilities

• Work closely with AOI/process/equipment engineering team to swiftly contain high Defect Density and inline excursions and find root causes and provide working solutions to satisfy customer quality
• Review unresolved requests for adjustment of complaints and read customer comments to determine basis of complaint and plan of action needed to resolve complaint
• Drive process improvement plan based on systematic analysis of inline/Electrical Test/yield data to meet quality and yield targets
• Identify key process weaknesses and perform fine tuning on existing processes for continuous improvement to yield/quality/productivity and cost
• Use statistical knowledge (e.g. DOE, SPC) and systematic problem-solving techniques(e.g. 8D, 5 Whys) to determine root causes for low yield wafers/lots as well as developing containment/corrective/preventive action plans
• Lead process control plan update and customer audit
• Supportnew Process/Product qualification from product design through to LVM completion

Requirement

• Degree in Physics, Chemistry, Material Science, Mechanical/Chemical/Electrical Engineering or equivalent
• 5to 10 years of relevant experience in wafer bumping, wafer fabrication or packaging
• Strong knowledge in process integration scheme/ process stability and yield enhancement activities

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.