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A leading company in semiconductor solutions is seeking a Process Integration Engineer specialized in advanced packaging technologies. This role emphasizes technical leadership and innovative project management, collaborating with cross-functional teams to drive integration of next-generation solutions. Ideal candidates will possess significant experience in semiconductor packaging and strong project management capabilities.
Lead the development and integration of advanced 2.5D and 3D heterogeneous packaging technologies. This position focuses on aligning cross-functional teams to deliver next-generation semiconductor packaging solutions through technical leadership, process innovation, and project execution.
Drive integration of 2.5D/3D packaging technologies
Manage projects, timelines, and budgets
Collaborate with R&D, design, and manufacturing teams
Identify and resolve technical integration challenges
Ensure quality control and compliance
Create technical documentation and reports
Mentor junior engineers and support knowledge transfer
Bachelor's/Master's in EE, Materials, or ME
10+ years in semiconductor packaging; 5+ years in 2.5D/3D integration leadership
Strong project and stakeholder management experience
Excellent problem-solving and communication skills
Proven leadership and cross-functional collaboration
Adaptable, quality-driven, and innovation-focused
If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
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