Process Engineer [Thermo Compression Bonding] | Up to $8K - YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading HR advisory firm in Singapore is seeking a TCB Process Engineer to develop TCB process parameters, troubleshoot bonding yield issues, and collaborate with various teams. The ideal candidate should have a background in Materials Science and 2–5 years of experience in semiconductor packaging. This role offers a competitive salary and an opportunity to work in a supportive environment.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging.
• Experience with TCB or similar bonding technologies is highly preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Troubleshoot yield issues related to TCB bonding.
• Define and maintain process documentation and SOPs.
• Conduct data analysis to validate process changes.
• Collaborate with quality teams for process qualification.

Skills

Hands-on experience in semiconductor packaging

Experience with bonding technologies

Collaboration with cross-functional teams

Education

Bachelor's or Master's degree in Materials Science

Job description

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: Sembawang
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279