Process Engineer [Thermo Compression Bonding] | Up to $8K - YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading company in Singapore is seeking a TCB Process Engineer to develop and optimize bonding processes for semiconductor applications. The role involves troubleshooting yield issues, working on new product introductions, and ensuring compliance with industry standards. Ideal candidates possess a relevant degree and experience with TCB technologies.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies is highly preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Troubleshoot yield issues and maintain process documentation.
• Support NPI and collaborate with quality teams.

Skills

Process Optimization

Troubleshooting yield issues

Data Analysis

Manufacturing Compliance

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field

Job description

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: Sembawang
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279