Process Engineer |Thermo Compression Bonding (TCB)

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading company in semiconductor packaging is seeking a TCB Process Engineer in Singapore. The role involves optimizing bonding processes, handling material evaluations, and ensuring production stability. Candidates should hold a degree in engineering and have 2-5 years of relevant experience in advanced interconnect processes or semiconductor packaging.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Evaluate new materials and troubleshoot yield issues related to TCB bonding.
• Ensure process stability and compliance with environmental and safety standards.

Skills

Troubleshooting

Process Optimization

Data Analysis

Collaboration

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field

Job description

Position title : TCB (Thermo Compression Bonding) Process Engineer

Location: North
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)

Interested applicants can also send your resume to WA:[phone] (Ms Angel) and allow our Consultant to match you with our Clients.

No Charges will be incurred by Candidates for any service rendered.

LIEW ONN KEE REG NO : R22108518

THE SUPREME HR ADVISORY EA NO:14C7279

Responsibilities:

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus
• Experience on N2 Environment is added advantage

Requirements:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.