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A leading electronics manufacturer in Singapore seeks an engineer to design high-density packaging methods for semiconductors. This role involves collaboration with R&D teams and customers to optimize processes and ensure quality. Candidates should be familiar with semiconductor tools and design of experiments.
Summary:
5 Days, 8am-5:30pm
Location: Yishun Industrial Park
Industry: Semiconductors & Electronics manufacturer in Singapore
MNC, great company prospects
AWS & Bonus given
Responsibilities:
Design and develop advanced packaging methods for assembling high-density, high-performance electronic devices.
Collaborate closely with external customers and partners to provide technical support and co-develop solutions.
Work closely with internal R&D, product teams, and external customers to develop new processes and products, ensuring alignment with technical requirements.
Develop and implement quality control measures, including work instructions, test procedures, and inspection plans, to ensure product standards are met.
Collaborate with various stakeholders, including project managers, quality teams, and production, to ensure successful implementation of engineering changes and process improvements.
Requirements:
Hands-on experience with different semiconductor assembly equipment is an advantage.
Proficient in using DOE (Design of Experiments) tools to plan and execute process optimization experiments.
Skilled in using analytical tools for failure analysis, such as SEM/EDX, C-SAM, AFM, confocal microscopes, surface profilers, and high-power optical microscopes.
Experience with simulation tools like ANSYS or ABAQUS to build model for stress and thermal simulation is a plus.
To Apply, kindly click on the "APPLY NOW" button
We regret that only shortlisted candidates will be notified.
Staffking Pte Ltd (20C0358) | Angel Lee Yueh Lin (R24120071)