Process Engineer (Mold, Plating, Laser Marking, Singulation)

Process Engineer (Mold, Plating, Laser Marking, Singulation)

Job Description:

Job Responsibilities:

• To continuously improve Assembly processes and assembly capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and controlled operating procedures.
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers requirements in terms of quantity, yield and cycle time.
• To provide interim and long-term corrective actions for any discrepancies through troubleshooting, parameter optimization and execution of defined process improvements.
• Liaise with internal (Manufacturing, Equipment, QA) and external customers on smooth transition and implementation of defined process activities and improvements.
• Prepare reports and documentation with respect to process, materials, customers, & other specifications as required.
• Perform cost reduction and cycle time improvement projects from conceptualization, planning, execution and implementation within specific time frame.

Requirements:

• Minimum 2 years semiconductor assembly packaging experience in process development or process sustaining. Flip Chip Molding (Vacuum Mold), Singulation Punch and Saw process experience preferred.
• Knowledgeable and application of Basic Problem Solving Tools and systems such as FMEA, Statistics (SPC), DOE (SAS Jmp), 8D report, QC Tools and others.
• Know-how in Failure Analysis and Reliability activities is an added advantage.
• Ability to work on 12-hour rotating shifts if required.

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

We regret that only shortlisted candidates will be notified.

People Profilers Pte Ltd