Process Engineer (Flip chip and Direct Die Attach)

Linxens Group; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading technology firm in Singapore seeks a Process Engineer specializing in Direct Die Attach and Flip Chip technologies. You will lead activities related to product industrialization, optimizing production efficiency while ensuring compliance with quality standards. The ideal candidate will have a Bachelor's degree in Engineering and at least 3 years of experience in the IC packaging industry. Join us to make an impact in a dynamic work environment with opportunities for professional growth.

Qualifications

• At least 3 years of experience in Direct Die Attach / Flip Chip packaging.
• Strong knowledge in Flip Chip and Die Attach technologies in IC packaging industries.

Responsibilities

• Lead activities related to Direct Die Attach / Flip Chip operations.
• Participate in new product introduction to deliver new products to market.
• Define machine process parameters and work instructions.

Skills

Direct Die Attach expertise

Flip Chip technology knowledge

Process optimization

Education

Bachelor's degree in Engineering / Electronics / Electronics packaging

Job description

Process Engineer (Flip chip and Direct Die Attach) page is loaded

Process Engineer (Flip chip and Direct Die Attach)

Apply locations Changi time type Full time posted on Posted 17 Days Ago time left to apply End Date: August 11, 2025 (12 days left to apply) job requisition id JR100745

The evolution of technology across the security and identity markets is both deep and never-ending. This is why Linxens ceaselessly invents new technical solutions and has a continuous-improvement program in place at all levels of the company.

Working for Linxens means having the chance to be a part of this innovation!

At Linxens, our employees’ know-how is what makes it possible for us to continually reinvent ourselves as a company and satisfy our customers’ needs. This means that our customers, in turn, can continue to move forward and evolve in their respective business domains, now and in the future. And this is why we invest so much energy in helping our employees hone and expand their skills.

Working for Linxens means investing in your future.

Our growth is creating great opportunities!

Here is a description of the role we are opening:

Job description

Process Parameters Definition, Qualification, and Compliance with Industrialization Performance Standards

• Lead and organise activities related to Direct Die Attach (DDA) / Flip Chip and Die Attach operations to support new product industrialization, optimizing production efficiency while complying with quality standards, cost, schedule, safety and environment
• Subject Matter Expert for advanced Direct Die Attach (DDA) / Flip Chip and Die Attach technology
• Prepare and review equipment specifications, select appropriate potential suppliers based on objective criteria
• Supervise related manufacturing line setup and commissioning
• Define machine process parameters and work instructions
• Lead Process Qualification (Installation Qualification (IQ),Operational Qualification (OQ),Performance Qualification (PQ)for the installed manufacturing line/ equipment
• Execute gap analysis
• Manage with Engineering /Maintenance and Operations to release new manufacturing line to operations (including standards, instructions, and OCAP etc)
• Perform gap analysis (machine, workforce, skill sets) in accordance with operations and quality requirements and implement improvement actions accordingly
• Continuous improvements - Identify and implement cost saving initiatives related to packaging materials, labor efficiency, integration of process, handling, etc

New Product Introduction

• Participate in new product introduction to deliver new products to market
• Analyze the manufacturing options vs. product requirements
• Understand current standards in substrate and packaging processes and propose optimization of company design for manufacturability, focusing in Direct Die Attach (DDA) / Flip Chip and conventional Die Attach applications
• Contributes to defining new packaging solutions for RFID and Smartcard, enabling better mechanical, thermal or electrical performance on the targeted applications
• Interfaces with other engineering functions to coordinate the release of new products and/ or product improvements
• Launches, releases, approves, implements or issues engineering change requests whenever required
• Performs Process Failure Mode, Effects and Criticality Analysis when working with New Product Development

Job requirements

• Bachelor's degree in Engineering / Electronics / Electronics packaging or equivalent
• At least 3 years of experience in Direct Die Attach / Flip Chip packaging
• Strong knowledge and understanding in Flip Chip and Die Attach technologies in IC packaging industries

If you like having an impact on wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

LINXENS is an equal-opportunity employer that strictly prohibits unlawful or unethical discrimination. Moreover, as part of our CSR Vitality program, we have committed to recruit, hire, train, compensate, and promote without regard to an individual’s race, color, religion, gender, sexual orientation, gender identity, national origin, age, mental/physical disability, marital status, or any other characteristic protected by law.

Similar Jobs (1)

Industrialization Engineer Healthcare

locations Changi time type Full time posted on Posted 30+ Days Ago