About Stats ChipPAC
Stats ChipPAC is at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow’s technology—from mobile devices to high-performance computing. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.
Responsibilities
- Perform routine chemical analysis of plating baths (e.g., nickel, copper, SnAg).
- Maintain bath chemistry with specified limits by adding required chemicals.
- Develop and optimize plating formulations and additive systems.
- Troubleshoot when plating concentration results are abnormal.
- Collaborate with plating process engineer to resolve process related issues.
- Document all test results, chemical additions, and bath maintenance.
- Develop and maintain standard operating procedures (SOPs) for chemical processes.
- Conduct chemical inventory management.
- Train lab technician on safe chemical handling and process best practices.
Required Experience and Qualifications
Required knowledge, skills and experience—however acquired:
- Bachelor’s degree in Chemistry, Chemical Engineering, or related field.
- 1–3 years of laboratory experience preferred.
- Strong knowledge of analytical chemistry techniques and instrumentation.
- Excellent organizational and record-keeping skills.
- Ability to work independently and collaboratively.
Why Join Us?
- Be part of an industry leader shaping the future of semiconductors
- Work with cutting-edge technologies and state-of-the-art equipment
- Clear career development pathways and mentorship from industry experts
- Dynamic, multicultural workplace that values collaboration and innovation
- Comprehensive benefits and employee-centric policies